Microsoft

Principal Signal and Power Integrity Engineer

Microsoft • $142K — $274K *
Mountain View, CA 94040In-Person
Enterprise Technology
Less than 5 years of experience
Today
Be an Early Applicant
Job Overview by Ladders

Qualifications

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field with 3+ years experience, or Master's with 6+ years experience, or Bachelor's with 8+ years experience, or equivalent.
  • Preferred MSEE with 10 years in silicon packaging product development.
  • Proven experience in power integrity modeling for high-performance computing (HPC) products.
  • Strong knowledge of advanced packaging technologies related to power integrity.
  • Experience with Foundry Silicon and OSAT technologies.

Responsibilities

  • Implement end-to-end power delivery design strategies for AI and compute SoCs.
  • Deliver system-wide SIPI solutions that meet HPC performance demands.
  • Develop future power delivery solutions compatible with chiplet architectures.
  • Design and simulate power integrity elements for data center processors.
  • Collaborate with cross-functional teams including silicon and platform architects.
  • Drive architectural solutions execution across multiple product lines.
  • Make engineering design decisions based on collaboration with stakeholders.

Benefits

  • Comprehensive health and wellness programs.
  • Generous paid time off and holidays.
  • Continuous learning and development opportunities.
  • Relocation assistance for eligible candidates.
Full Job Description
Responsibilities

The SMPE silicon team is seeking a passionate, driven, and intellectually curious computer/electrical engineer to deliver premium-quality designs once considered impossible. We are responsible for delivering cutting-edge, custom IP and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.
  • PI engineer for compute and AI SoCs and platforms - Implement strategies for end-to-end power delivery design from Silicon to Package, and linking to Platform to System and Cloud
  • Deliver SIPI solutions that meet the HPC demands across the entire system.
  • Drive future power delivery solutions for chiplet architecture with advanced packaging and advanced silicon nodes
  • Design, model, and simulate PI (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance. Performs DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and link/electrical simulations to validate I/O performance from platform to silicon.
  • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
  • Drives the execution of architecture solutions across product lines or multiple product groups across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry practices, and lessons learned from teams working across multiple product lines
  • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.


Qualifications

Required Qualifications:
  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.

Preferred Qualifications:
  • MSEE degree with 10 years' experience in silicon packaging products development
  • Experience with power integrity modelling for HPC products
  • Strong foundation in advanced packaging technologies as it relates Power integrity
  • Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies
  • MS degree with minimum 7+ years of experience in silicon/package/system power integrity/delivery
  • BSEE degree with minimum 10 years' experience in silicon/package/system power integrity/delivery
  • Experienced in the field of Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 7 years' experience in design and electrical modelling
  • Good working knowledge in the field of end to end system SIPI Design and Architecture
  • Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design
  • Interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation

Screening Requirements
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
  • This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.


Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

About Microsoft

Microsoft is an American multinational corporation that develops, manufactures, licenses, supports, and sells a range of software products and services. Microsoft’s devices and consumer (D&C) licensing segment licenses the Windows operating system and related software, Microsoft Office for consumers, and the Windows Phone operating system. The company’s computing and gaming hardware segment provides Xbox gaming and entertainment consoles and accessories, second-party and third-party video games, and Xbox Live subscriptions; surface devices and accessories; and Microsoft PC accessories. Its phone hardware segment offers Lumia smartphones and other non-Lumia phones. Its D&C segment provides Windows Store, Xbox Live transactions, and Windows phone store; search advertising; display advertising; Office 365 Home and Office 365 Personal; first-party video games; and other consumer products and services as well as operating retail stores. Microsoft’s commercial licensing segments license server products, including Windows Server, Microsoft SQL Server, Visual Studio, System Center, and related Client Access Licenses (CALs); Windows Embedded; Windows operating system; Microsoft Office for business, including Office, Exchange, SharePoint, Lync, and related CALs; Microsoft Dynamics business solutions; and Skype. Its commercial segment offers enterprise services, including premier support services and Microsoft consulting services; commercial cloud comprising Office 365 Commercial, other Microsoft Office online offerings, Dynamics CRM Online, and Microsoft Azure; and other commercial products and online services. The company markets and distributes its products through original equipment manufacturers, distributors, and resellers, as well as online.

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Learn more about Microsoft
Size
181,000 employees
Market Cap
$1,762.4 billion
Industry
Enterprise Technology
Net Income
$51.3 billion
Founded
1975
5 Year Trend
+15.5%
Revenue
$153.2 billion
NASDAQ
MSFT
* Ladders Estimates

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