Ciena

Principal SI/PI Design Engineer

Ciena$148K — $237K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • BS in Electrical Engineering or Physics
  • 5+ years hands-on experience with IC package design
  • Experience with signal/power integrity fundamentals
  • Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS

Responsibilities

  • Drive advanced package selection and configuration for new products
  • Lead package/SIP layout and design verification
  • Coordinate with cross-functional teams on design feasibility
  • Optimize silicon floor plans and package pin layouts
  • Simulate signal/power integrity and RF performance
  • Work with CMs and vendors for sourcing designs

Benefits

  • Comprehensive medical, dental, and vision plans
  • 401(K) and DCPP participation with matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Paid holidays, sick leave, and vacation time
Full Job Description
How You Will Contribute:

As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.

  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Interface and work with CMs and vendors for the sourcing existing designs and future product development

Must Haves:

  • BS in Electrical Engineering or Physics
  • 5+ years hands on experience with IC package design

Assets:

  • Substrate design experience for RF, digital, high speed and mixed signal die
  • Thorough understanding of signal and power integrity fundamentals
  • Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
  • Experience in package design electrical review, SI/PI analysis
  • Experience in package design for manufacturing reviews
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
  • Problem solver with strong engineering fundamentals

Pay Range:

The annual salary range for this position is $148,600 - $237,400 USD

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.

At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard.  Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

About Ciena

Ciena Corporation is a global supplier of telecommunications networking equipment, software, and services. The company was founded in 1992 and is headquartered in Hanover, Maryland. Ciena's products include optical transport and switching systems, software, and services that support the transport, switching, aggregation, and management of voice, video, and data traffic. Ciena serves customers in the telecommunications industry, including telecommunications service providers, cable operators, governments, and enterprises. The company has approximately 7,000 employees worldwide and operates in more than 100 countries.
Learn more about Ciena
Size
7,241 employees
Market Cap
$7.3 billion
Industry
Net Income
$354.3 million
Founded
1992
5 Year Trend
+5.3%
Revenue
$3.4 billion
NASDAQ

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