Renesas Electronics America

Principal Product Engineer

Renesas Electronics America$120K — $145K *
Aerospace & Defense
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering required.
  • 10+ years of semiconductor new product development experience.
  • Strong background in semiconductor/IC technology.
  • Experience with Product Engineering and new product introduction (NPI).
  • Proficient in IC characterization and performance evaluation.
  • Excellent data analysis skills for semiconductor product data interpretation.
  • Strong problem-solving and communication abilities across teams.

Responsibilities

  • Lead Product Engineering for new ICs from development to production.
  • Coordinate with various engineering teams on product activities.
  • Plan and conduct IC characterization to assess performance.
  • Analyze production data to track trends and improvement areas.
  • Utilize data-driven insights for product reliability and quality.
  • Collaborate with Test Engineering for readiness and strategy.
  • Facilitate root-cause analysis for product and manufacturing complications.
  • Contribute to specifications, testing criteria, and qualification processes.
  • Identify and implement enhancements in product release and NPI execution.

Benefits

  • Competitive benefits package offered to employees.
  • More detailed benefits information provided during the hiring process.
Full Job Description
We are currently looking for a Principal Product Engineer to join our Hi-Reliability team in Palm Bay, Florida. In this role, you'll help bring advanced IC products from development through characterization, qualification, and production, working across engineering teams to solve complex product challenges and support semiconductor technologies designed for demanding space and high-reliability applications. As a Principal Product Engineer on our Hi-Reliability team in Palm Bay, Florida, you'll apply your semiconductor expertise to develop and deliver high-reliability ICs for space and harsh environments. Lead projects from development through NPI, characterization, qualification, manufacturing readiness, and production release. Collaborate with cross-disciplinary experts in design, test, reliability, packaging, radiation effects, and manufacturing to solve complex challenges, drive continuous improvement, and ensure the delivery of reliable, manufacturable semiconductor solutions. Responsibilities • Lead Product Engineering activities for new ICs from initial silicon through characterization, qualification, production readiness, and release. • Coordinate product engineering activities across IC design, test, applications, packaging, reliability, radiation effects, assembly, and manufacturing teams. • Plan and execute IC characterization to evaluate electrical performance and product requirements. • Analyze characterization, test, yield, and production data to identify trends, performance margins, risks, and improvement opportunities. • Use data-driven analysis to support product decisions and investigate performance, yield, quality, reliability, and manufacturability issues. • Partner with Test Engineering on characterization, production test strategy, ATE activities, correlation, and product readiness. • Support investigation and root-cause analysis of complex product and manufacturing issues. • Contribute to product specifications, qualification activities, test requirements, and release criteria. • Identify opportunities to improve NPI execution, characterization, data analysis, yield, and product release processes. • Communicate technical findings, risks, and recommendations across engineering teams and project stakeholders. Qualifications Required • Bachelor's degree in Electrical Engineering. • 10+ years of experience executing new product development within the semiconductor industry. • Strong semiconductor/IC experience. • Experience with Product Engineering and semiconductor new product introduction (NPI). • Experience with IC characterization and evaluation of product performance. • Strong data analysis capability, including interpretation of characterization, test, yield, production, or other semiconductor product data. • Strong problem-solving, communication, and cross-functional collaboration skills. Preferred • Radiation-hardened IC or radiation-effects experience. • Space, high-reliability, or harsh-environment semiconductor experience. • Familiarity with MIL-PRF-38535 or related high-reliability semiconductor standards. • Experience with semiconductor Automated Test Equipment (ATE). • Experience with ATE platforms such as Advantest V93K, Teradyne UltraFLEX/microFLEX, ETS-64, or similar systems. • Experience with bench testing, IC debug, silicon bring-up, or electrical validation. • Experience with bench-to-ATE correlation or production test correlation. • Experience using JMP, Spotfire, Python, or similar statistical/data-analysis tools. • Experience with analog, mixed-signal, power management, or other complex IC technologies. • Previous technical leadership, mentoring, or cross-functional technical ownership experience. • Master's degree in Electrical Engineering. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Videos To Watch https://www.youtube.com/embed/k-zs4tB6nNc

About Renesas Electronics America

Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
Learn more about Renesas Electronics America
Size
2,000 employees
Industry

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