As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: • Develop, diagnose, and resolve various die bonding process technologies • Coordinate and manage process, equipment, and material evaluation/optimization initiatives and implement changes at process step • Lead and participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives • Support SPC/FDC/RMS/APC and site-to-site portability • Support internal and external audits Minimum Qualifications: • A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering • Solid engineering knowledge of semiconductor advanced packaging die stacking processes • Skilled at designing valid tests and Design of Experiments (DOE) • Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs • Knowledge and an understanding of project management and experience leveraging AI to design experiments Preferred Qualifications: • Masters or Doctorate degree in Engineering, Physics, or related field • 5+ years experience in working on Die Bonding in Advanced Packaging settings; Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration • Bonding experience at a Vendor, Research Institute, or Semiconductor Industry Equipment Supplier or Integrator • Excellent oral and written communication skills and a strong attention to detail • Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.