Principal Physical Design Engineer

Celero Communications, Inc.

$150K — $250K *
Telecommunications & Hardware
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 7+ years of ASIC physical design experience required
  • Experience with advanced technology nodes (7nm, 5nm, 3nm)
  • Advanced proficiency in Cadence EDA tools like Innovus and Tempus
  • Strong understanding of power domain analysis and EM/IR cleanup
  • Familiarity with scripting languages such as Tcl, Python, or Perl for automation

Responsibilities

  • Own physical implementation of System-on-Chips (SoCs) or complex digital blocks
  • Manage floor-planning, bump planning, and power grid design to optimize performance
  • Resolve timing, congestion, and EM/IR issues with Frontend Designers
  • Conduct Static Timing Analysis (STA) and physical verification to ensure design quality
  • Drive automation and improve flow robustness with scripting
  • Collaborate with cross-functional teams for successful tape-out readiness

Benefits

  • Mentorship opportunities in a technical leadership role
  • Exposure to cutting-edge technology nodes
  • Contribution to next-generation semiconductor products
  • Collaboration with a diverse range of engineering teams
  • Potential to shape methodologies in physical design
Full Job Description
We are seeking an experienced Physical Design Engineer to lead the transformation of complex circuit designs into high-quality, manufacturable silicon. In this role, you will drive all aspects of the physical implementation flow, including floorplanning, power planning, place-and-route (P&R), clock tree synthesis, timing closure, and physical verification. You will collaborate closely with architecture, RTL, circuit design, and verification teams to deliver high-performance chips that meet aggressive targets for performance, power, area (PPA), signal integrity, and manufacturability. As a technical leader, you will help define physical design methodologies, mentor engineers, and ensure successful tape-out of next-generation semiconductor products. Core Responsibilities • RTL-to-GDSII Execution: Own physical implementation of System-on-Chips (SoCs) or complex digital blocks. • Design Optimization: Manage floor-planning, bump planning, power grid design, and clock tree synthesis (CTS) to optimize chip performance. • Design Convergence: Resolve timing, congestions, EM/IR issues together with Frontend Designers • Signoff & Verification: Run Static Timing Analysis (STA) and physical verification. Fix Design Rule Checking (DRC) and Layout Versus Schematic (LVS) violations. • Methodology Development: Drive automation and improve flow robustness using scripting languages like Tcl, Python, or Perl. • Cross-Functional Leadership: Partner with architects, logic designers, and analog design team for tapeout readiness. Key Qualifications • Must have 7+ years of relevant ASIC physical design experience (depending on degree level). • Process Knowledge: Deep tapeout experience in advanced technology nodes (e.g., 7nm, 5nm, 3nm). • Tool Mastery: Advanced proficiency with industry-standard EDA tools from vendors like Cadence (e.g., Innovus, Tempus, Voltus, Pegasus, Calibre). • Technical Concepts: Expertise in physically aware synthesis, power domain analysis, and Electromigration/IR-drop (EM/IR) cleanup. Annual Base Salary Range: $150,000 to $250,000 (The final offer will be determined based on job-related skills, experience, qualifications, and location.)

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