Principal Physical Design Engineer

Celero Communications, Inc.

$200K — $300K *
Telecommunications & Hardware
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 7-15 years of ASIC physical design experience based on degree level
  • Deep familiarity with tapeout processes in advanced technology nodes (7nm, 5nm, 3nm)
  • Expertise in industry-standard EDA tools from Cadence such as Innovus and Tempus
  • Strong knowledge of physically aware synthesis and power domain analysis
  • Experience in Electromigration/IR-drop (EM/IR) cleanup.

Responsibilities

  • Own physical implementation of SoCs or complex digital blocks from RTL to GDSII
  • Manage floor-planning, bump planning, and power grid design to optimize chip performance
  • Collaborate with Frontend Designers to resolve timing and congestion issues
  • Run Static Timing Analysis (STA) and conduct physical verification
  • Drive automation and improve design flow robustness using scripting languages
  • Partner with architects and design teams to ensure tapeout readiness.

Benefits

  • Comprehensive health, dental, and vision insurance
  • Flexible work hours and remote work options
  • Generous PTO policy including vacation and sick leave
  • Retirement savings plan with company matching
  • Opportunities for professional development and continuous learning.
Full Job Description
Senior/Principal Physical Design Engineer

Core Responsibilities
• RTL-to-GDSII Execution: Own physical implementation of System-on-Chips (SoCs) or complex digital blocks.
• Design Optimization: Manage floor-planning, bump planning, power grid design, and clock tree synthesis (CTS) to optimize chip performance.
• Design Convergence: Resolve timing, congestions, EM/IR issues together with Frontend Designers
• Signoff & Verification: Run Static Timing Analysis (STA) and physical verification. Fix Design Rule Checking (DRC) and Layout Versus Schematic (LVS) violations.
• Methodology Development: Drive automation and improve flow robustness using scripting languages like Tcl, Python, or Perl.
• Cross-Functional Leadership: Partner with architects, logic designers, and analog design team for tapeout readiness.

Key Qualifications
• Experience: 7+ to 15+ years of relevant ASIC physical design experience (depending on degree level).
• Process Knowledge: Deep tapeout experience in advanced technology nodes (e.g., 7nm, 5nm, 3nm).
• Tool Mastery: Advanced proficiency with industry-standard EDA tools from vendors like Cadence (e.g., Innovus, , Tempus, Voltus, Pegasus, Calibre).
• Technical Concepts: Expertise in physically aware synthesis, power domain analysis, and Electromigration/IR-drop (EM/IR) cleanup.

Annual Base Salary Range: $200,000 to $300,000 (The final offer will be determined based on job-related skills, experience, qualifications, and location.)

Javier Leon
Talent Acquisition

[email protected]
www.celero.inc

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