Job Description:

Duties: Perform semiconductor engineering design, development, and testing for firm products and devices in conjunction with product development for the electronic communications industry. Work on a wide range of SoCs spanning different process technologies and market segments to produce a best-in-class combination of power, performance, and thermal behavior. Responsible for device to architecture level optimizations as well as hardware/software co-design. Design a wide-range of SoC solutions from very cost-sensitive, low power devices to highly integrated, high-performance devices with world-wide network of design centers. Research, design, and develop forward looking methodologies, novel infrastructures and architectures for system resource control and holistic energy management. Identify new techniques in areas for Energy reduction for CPU/GPU/Camera/DDR/ML accelerators both at core and SoC level. Experiment with new EDA tools and provide necessary automation to simplify system tradeoff analysis. Collaborate with performance, thermal and system teams in system-level analysis of workloads and use-cases to identify opportunities of energy optimization. Participate in efforts to develop and prototype new system solutions and approaches.

Qualifications:

Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, foreign equivalent or related field.

Five (5) years of experience in job offered Staff Design Engineer, or related occupation.

Required skills:

Position requires five (5) years of experience in:

1.Understanding of Models (NLDM, AOCV, CCS, ECSM, LVF);

2.Cadence IC Design Suite, Innovus, Synopsys PrimeTime;

3.TCL, Perl

4.Time and test chip blocks,

5.Physical Design;

6.Synthesis;

7.Physical Verification;

8.Place and route; and

9.Floorplan.

Salary: $187,272 per year