Qorvo, Inc

Principal Digital IC Design Engineer

Qorvo, Inc • $150K — $180K *
Telecommunications & Hardware
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering
  • 12+ years of experience in digital ASIC design and implementation
  • Mastery of SystemVerilog and Verilog
  • Comprehensive command of the RTL-to-GDSII flow
  • Deep proficiency with Synopsys or Cadence EDA tools
  • Strong programming skills in Python, TCL, and Bash/Perl
  • Proven mentorship abilities and strong communication skills

Responsibilities

  • Define and optimize ASIC design methodologies and architectures
  • Act as the chief technical authority across cross-functional domains
  • Provide expert guidance on engineering trade-offs for Power, Performance, and Area
  • Translate system-level requirements into SoC/ASIC microarchitectures
  • Write scalable and synthesizable hardware description code
  • Collaborate with Design Verification teams on test plans and DFT structures
  • Drive execution through synthesis, floorplanning, and Place & Route flows
  • Oversee physical verification checks to ensure tape-out readiness

Benefits

  • Opportunity to lead next-generation silicon development
  • High-impact technical leadership role
  • Collaborative environment with cross-functional teams
  • Mentorship opportunities to develop engineering talent
  • Access to cutting-edge design methodologies and tools
Full Job Description
We are seeking a experienced and visionary Principal ASIC Engineer to lead our next-generation silicon development. In this high-impact technical leadership role, you will own the full-flow ASIC development lifecycle, driving projects from initial architectural concepts and RTL design down to physical sign-off and silicon bring-up. The ideal candidate possesses deep expertise across both front-end design and back-end implementation, serving as a strategic authority who bridges the gap between hardware architecture, microarchitecture, and complex physical layout constraints. Key Responsibilities Technical Leadership & Strategy • Define, establish, and optimize cutting-edge ASIC design methodologies and full-flow architectures across the organization. • Act as the chief technical authority to align cross-functional domains including Architecture, RTL Design, Verification, and Physical Design. • Provide expert guidance on complex engineering trade-offs evaluating Power, Performance, and Area (PPA). Front-End Design & Architecture • Translate complex system-level product requirements into functional SoC/ASIC microarchitectures. • Write high-quality, scalable, and synthesizable hardware description code using SystemVerilog/Verilog. • Collaborate closely with Design Verification (DV) teams to review test plans and implement advanced Design for Testability (DFT) structures Back-End & Physical Implementation • Drive full chip-level and block-level execution through synthesis, floorplanning, and automated Place & Route (P&R) flows. • Formulate and sign off on rigorous Timing Constraints and execute deep Static Timing Analysis (STA) to resolve setup/hold violations. • Oversee structural physical verification including DRC, LVS, and ERC checks to guarantee tape-out readiness. Required Qualifications Education & Experience • Bachelor's degree in Electrical Engineering • 12+ years of expereince or equivalent amount of advanced education and experience in direct, practical industry experience in digital ASIC design and implementation with a proven history of multiple successful commercial tape-outs. Technical Competencies • Hardware Languages: Mastery of SystemVerilog and Verilog. • Full-Flow Implementation: Comprehensive hands-on command of the RTL-to-GDSII flow (Logic Synthesis, Floorplanning, CTS, P&R, STA, and Physical Verification). • EDA Tool Ecosystems: Deep proficiency with flagship EDA toolsuites from Synopsys (Design Compiler, IC Compiler II, PrimeTime) or Cadence (Genus, Innovus, Tempus). • Scripting & Automation: Strong programming proficiency in Python, TCL, and Bash/Perl for methodology customization and CAD data manipulation. • Post-Silicon Execution: Direct experience with actual silicon bring-up, hardware debugging, and lab evaluation. Leadership & Soft Skills • Strong mentorship capabilities with a track record of leveling up senior and mid-level engineering talent. • Excellent written and verbal communication skills, with the ability to articulate highly abstract hardware complexities to non-technical stakeholders Preferred Qualifications: • Master's or PhD degree in Electrical Engineering • Prior experience with Power Management IC's #LI-NN1

About Qorvo, Inc

Qorvo, Inc is a semiconductor company that designs, manufactures, and supplies radio frequency (RF) solutions for smartphones, tablets, wireless infrastructure, defense and aerospace applications, and Internet of Things (IoT) applications. The company's products include amplifiers, filters, switches, and integrated modules that support a range of wireless communications standards. Qorvo was formed in 2015 as a result of the merger between RF Micro Devices and TriQuint Semiconductor. The company is headquartered in Greensboro, North Carolina.
Learn more about Qorvo, Inc
Size
8,900 employees
Market Cap
$9.1 billion
Industry
Net Income
$485.2 million
Founded
2013
5 Year Trend
+8.9%
Revenue
$3.7 billion
NASDAQ

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