Qorvo, Inc

Principal Systems/Applications Engineer

Qorvo, Inc$130K — $155K *
Technical Services
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Physics, or a related technical discipline
  • 12+ years of relevant industry experience or equivalent education and experience
  • Experience in product definition and customer engagement, translating requirements into specifications
  • Hands-on experience with power IC packaging technologies and design
  • Demonstrated knowledge in developing technical documentation for semiconductor products
  • Experience with BLDC/PMSM motor drive systems
  • Familiarity with field-oriented control algorithms for motor applications

Responsibilities

  • Collaborate with customers and teams to define motor control products based on market needs
  • Translate system requirements into specifications for IC design teams
  • Define product pinouts and develop packaging concepts with the packaging team
  • Create comprehensive product characterization plans with test engineers
  • Produce and maintain technical documentation including datasheets and user guides
  • Propose system-level motor drive solutions tailored to customer applications
  • Provide technical support and training to customers and internal teams

Benefits

  • Opportunities for professional growth and development
  • Flexible working environment promoting work-life balance
  • Engagement with cutting-edge technologies in multiple markets
  • Collaboration with a talented and experienced team
  • Supportive culture fostering innovation and creativity
Full Job Description
The fast-growing Power Management division focusing on Motor Control & Drive and Analog Power is looking for a highly motivated and experienced Principal Systems & Application Engineer to define new Motor Control and Drive solutions for industrial, consumer, and automotive markets and to support key global customers.

Responsibilities:
  • Work with customers, marketing, and sales teams to define motor control and drive products and solutions, translating customer and market needs into product architecture, specifications, system requirements, feature definitions, and competitive analysis.
  • Work closely with IC design teams to translate system-level and product requirements into internal IC and subsystem specifications for new products.
  • Work with the packaging team to define product pinouts and develop package concepts and preliminary drawings for new products, considering system, electrical, thermal, mechanical, and customer application requirements.
  • Work with test and characterization engineers to develop comprehensive product characterization plans and production test solutions to ensure product performance against specifications.
  • Generate and maintain product documentation and technical collateral, including datasheets, user guides, application notes, customer presentations, white papers, and training materials.
  • Define and propose system-level motor drive solutions for key customers based on customer application requirements and input from field application engineers and sales teams.
  • Provide technical support and training to key customers, field application engineers, and sales teams, including product evaluation, design-in, system bring-up, and troubleshooting.
  • Support key customers with existing products by addressing application and system-level issues, identifying product limitations, and incorporating customer learnings into future product improvements and new product definitions.
  • Coach and mentor other systems and application engineers.


Required Qualifications:
  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Physics, or a related technical discipline
  • 12+ years of relevant industry experience or an equivalent amount of education and experience
  • Demonstrated product definition and customer engagement experience with a track record of translating customer and market requirements into product architecture, features, and specifications.
  • Experience with power IC packaging technologies, including package concept development, pinout definition, and electrical and thermal considerations.
  • Hands-on experience with package laminate/substrate design, including layer stack-up, routing, and electrical and thermal considerations.
  • Demonstrated experience developing technical documentation for semiconductor products, including datasheets, user guides, and application notes.
  • Hands-on experience with BLDC/PMSM motor drive systems for industrial, automotive, and consumer applications.
  • Experience with DC/DC and AC/DC power supply design.
  • Deep understanding of gate drivers, inverter power-stage operation, and associated protection functions.
  • Familiarity with field-oriented control and trapezoidal control algorithms for BLDC/PMSM motors.
  • Experience with microcontrollers, especially Arm Cortex-M devices, including ADCs, PWM timers, PLL and clocking, Flash, and communication interfaces such as I2C, SPI, UART, CAN and LIN.
  • Experience with PCB design and layout, CAD tools such as AutoCAD, and circuit/system simulation tools such as MATLAB and QSPICE.
  • Strong attention to detail, analytical thinking, and system-level troubleshooting skills.
  • Strong verbal and written communication skills, with the ability to communicate complex technical concepts effectively to audiences with varying levels of technical expertise.
  • Ability and willingness to travel domestically and internationally to engage with customers.


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About Qorvo, Inc

Qorvo, Inc is a semiconductor company that designs, manufactures, and supplies radio frequency (RF) solutions for smartphones, tablets, wireless infrastructure, defense and aerospace applications, and Internet of Things (IoT) applications. The company's products include amplifiers, filters, switches, and integrated modules that support a range of wireless communications standards. Qorvo was formed in 2015 as a result of the merger between RF Micro Devices and TriQuint Semiconductor. The company is headquartered in Greensboro, North Carolina.
Learn more about Qorvo, Inc
Size
8,900 employees
Market Cap
$9.1 billion
Industry
Net Income
$485.2 million
Founded
2013
5 Year Trend
+8.9%
Revenue
$3.7 billion
NASDAQ

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