Qualifications

• Bachelor's degree in Mechanical, Electrical, Manufacturing, Material Engineering, or related field; Master's degree preferred.
• 2+ years of relevant industry experience or a postgraduate degree in lieu of experience.
• Relevant industry internship experience is desired.
• Strong background in Semiconductor Assembly with experience in fine pitch components like BGA and QFN.
• 1-2 years of experience in a mid to high-volume manufacturing environment is preferred.
• Familiarity with reflow, pick and place, and solder paste printing is preferred.
• Knowledge of IPC-A-610 standard is preferred.

Responsibilities

• Develop and optimize SMT, semiconductor packaging, and advanced assembly processes.
• Support volume production and New Product Introduction (NPI) production efforts.
• Assist in manufacturing for surface mount electronics (SMT) as well as Flip Chip Attach and Die Attach.
• Lead process characterization, Design of Experiments (DOE) execution, and process window development.
• Evaluate new equipment, processes, and materials for manufacturing.
• Generate post build and Design for Manufacturability (DFM) reports.
• Monitor product yields daily and work with engineers for corrective actions.

Benefits

• Standard benefits package including health insurance and retirement plans.
• Opportunities for professional development and career growth.
• Collaborative work environment with a focus on innovation.
• Access to cutting-edge technologies and equipment in the semiconductor field.