Renesas Electronics America

Principal Device Design & Integration Engineer

Renesas Electronics America$180K — $230K *
Technical Services
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, or related field.
  • 10+ years of hands-on design experience in power semiconductor devices, analog/power ICs, or power electronics.
  • Strong working knowledge of power conversion topologies and their device requirements.
  • Solid understanding of power device physics and tradeoffs across BCD and GaN technologies.
  • Demonstrated experience designing test structures for process technology development.
  • IC-level design and layout experience, with focus on parasitic-sensitive layouts.
  • Proficiency with circuit simulation tools and device/TCAD simulation concepts.

Responsibilities

  • Define and execute test vehicles for high-current BCD and low-voltage GaN technologies.
  • Translate product roadmap requirements into specifications for test vehicles.
  • Design and simulate power stage circuits to validate device performance.
  • Select and characterize power devices for test structures in collaboration with engineering teams.
  • Perform IC-level layout and design for test structures, focusing on parasitic effects.
  • Extend designs to module/package level for system-level evaluation.
  • Develop comprehensive test and characterization plans for device performance analysis.

Benefits

  • Full range of elective benefits including medical, dental, and vision insurance.
  • Health savings account and flexible spending accounts for healthcare expenses.
  • Company-paid life insurance and accidental death and dismemberment (AD&D) coverage.
  • Short-term medical benefits, paid sick time, and paid holidays.
  • Accrued paid vacation and opportunities for bonus compensation.
Full Job Description
We are seeking a Design Engineer to lead the development of test vehicles supporting our high-current BCD (Bipolar-CMOS-DMOS) and low-voltage GaN power process and product portfolios. This role owns test vehicle definition, circuit and layout design, and characterization planning from concept through silicon bring-up, working closely with process development, product engineering, and applications teams. The ideal candidate has hands-on experience designing power devices and circuits at both the IC and module level, and is fluent in the power topologies these test vehicles are ultimately intended to support. Key Responsibilities • Define, design, and drive execution of test vehicles (TVs) for high-current BCD and LV GaN process technologies, including device test structures, scaled power stages, and full-function demonstration circuits. • Translate process capability targets and product roadmap requirements into test vehicle architecture and specifications. • Design and simulate power stage circuits (e.g., synchronous buck/boost, multiphase, half-bridge/DrMOS, gate drivers) used to validate device performance under realistic switching and thermal conditions. • Select and characterize power devices (LDMOS, trench MOSFETs, LV GaN HEMTs, Schottky/sync rectifiers) for inclusion in test structures, working with device/process engineering on layout-dependent tradeoffs (RDS(ON), Qg, breakdown voltage, SOA). • Perform IC-level layout and design for test structures, including parasitic-aware layout for switch nodes, current sensing, and gate drive paths. • Extend designs to module/package level as needed - co-design of power stages with packaging, magnetics, and PCB layout for evaluation boards and system-level test vehicles. • Develop test and characterization plans covering DC parametrics, switching performance, efficiency, transient response, and voltage/current stress margins (including switch-node ringing and abs-max validation). • Lead or support silicon bring-up, debug, and correlation of measured results against simulation and design targets. • Collaborate cross-functionally with process integration, reliability, product/applications engineering, and test engineering to close the loop from process split data to product-ready specifications. • Document design methodology, test vehicle results, and characterization data to support technology qualification and product development decisions. Qualifications • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, or related field. • 10+ years of hands-on design experience in power semiconductor devices, analog/power ICs, or power electronics. • Strong working knowledge of power conversion topologies (e.g., buck, boost, multiphase/interleaved converters, half-bridge, DrMOS/Intelli-Phase-style architectures) and how topology choices drive device requirements. • Solid understanding of power device physics and tradeoffs across BCD process technologies and GaN (particularly low-voltage GaN HEMTs) - including RDS(ON), switching loss, gate charge, breakdown/avalanche behavior, and thermal characteristics. • Demonstrated experience designing test structures or test chips/vehicles for process technology development (not just product design) - comfortable defining what a process node needs to prove out. • IC-level design and layout experience, including parasitic-sensitive layout practices for high-current switching nodes. • Experience taking designs beyond the die level to module, package, or board level (e.g., power module co-design, evaluation board layout, thermal/electrical co-design). • Proficiency with circuit simulation tools (SPICE or equivalent) and familiarity with device/TCAD simulation concepts. • Ability to interpret and specify absolute maximum ratings, transient voltage tolerance, and protection thresholds (OVP/UVP/OCP/OTP) relevant to power stage reliability. • Strong lab skills: bring-up, debug, and characterization using oscilloscopes, curve tracers, power analyzers, and thermal imaging. Additional Information The expected annual pay range for this position is $180K - $230K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Videos To Watch https://www.youtube.com/embed/k-zs4tB6nNc

About Renesas Electronics America

Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
Learn more about Renesas Electronics America
Size
2,000 employees
Industry

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