Signal Integrity / Power Integrity Engineer to join our expanding Hardware team. In this role, you will help deliver high-performance PCB and package designs for advanced ASIC platforms. You will apply deep expertise in signal and power integrity to solve complex system-level challenges spanning high-speed SERDES channels, high-current power-delivery networks, packages, PCBs, and supporting infrastructure.
You will work in a dynamic, cross-functional environment to model, optimize, and validate critical electrical interfaces. Partnering closely with hardware engineers and outside design partners, you will translate electrical requirements into timely, performant, robust, testable, and manufacturable designs.
Responsibilities- Develop creative signal integrity (SI) and power integrity (PI) solutions for complex system design challenges
- Analyze and guide high-speed PCB, BGA, and advanced package designs from 28+ Gbps through the latest signaling technologies
- Run system-level SI simulations for high-speed SERDES links, and model, optimize, and validate vias, connectors, sockets, breakouts, stackups, routing, and package interfaces using 3D EM and circuit simulation tools
- Drive substrate and board-layout SI guidelines, post-layout extraction and analysis, and ongoing improvement of models and methodologies against lab measurements
- Analyze and guide power delivery for ASICs drawing 500+ amps, including static/DC and dynamic/AC analysis across the full power train - PSUs, cables, connectors, voltage regulators, PCBs, capacitor networks, packages, and dies
- Automate simulation, data gathering, analysis, and visualization workflows
- Partner with external design and layout vendors on requirements, deliverables, and tradeoffs, and collaborate with internal electrical, mechanical, package, layout, manufacturing, and validation teams throughout the lifecycle
Qualifications- MS or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field, or equivalent practical experience
- Experience in signal integrity, power integrity, or both for high-performance electronic systems
- Strong fundamentals in electromagnetics, transmission lines, and PCB/package design
- Experience with high-speed SERDES links, including at least 28+ Gbps signaling; PAM4 at 56/112+ Gbps is preferred
- Experience with high-current (>500 amp) ASIC power supply design
- Proficiency with SI/PI CAE and circuit-simulation tools
- Experience with relevant SI/PI tools such as HFSS, SIwave, Clarity 3D, Sigrity, ADS, SPICE, SIMPLIS, or MATLAB
- Python programming or scripting automation experience for analysis, validation, or debugging
- Ability to translate analysis results into robust, manufacturable PCB and package designs
- Strong collaboration and communication skills, including experience working with external design partners
- Experience with 2.5D packages, board/package layout, or PDN evaluation is preferred
- Familiarity with lab measurement equipment, including VNAs, TDRs, and high-speed oscilloscopes is preferred
The estimated base salary range for this position is $200,000 to $300,000 USD per year (or local equivalent). The base pay offered may vary depending on multiple individualized factors, including location, job-related knowledge, skills, and experience. This role will also be eligible for discretionary performance-based bonuses and a competitive benefits package.
