Job Details:Job Description: Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap — from high-performance computing to mobile applications.
This is a unique opportunity to work alongside world-class engineers, contribute to groundbreaking research and development, and directly influence the future of advanced semiconductor packaging at one of the most recognized technology companies in the world.
Key Responsibilities
Develop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets in high-volume manufacturing environments.
Design and implement process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.
Conduct Design of Experiments (DOE) to analyze process windows and understand interactions between materials, equipment, and chemistry.
Drive continuous process improvements to enhance capability, stability, quality, and overall productivity.
Collaborate with cross-functional teams — including design, materials, and manufacturing — to resolve complex technical challenges and deliver impactful solutions.
Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
Document technical findings and process innovations through detailed reports and technical papers.
Support standardization of manufacturing systems and qualification procedures to ensure consistency and scalability across global operations.
Provide sustaining support for equipment performance and process health in high-volume manufacturing settings.
As a successful candidate, you must possess
Collaborative Spirit — You thrive in team environments and enjoy working across diverse, cross-functional groups to achieve shared goals.
Intellectual Curiosity — You have a passion for learning, exploring new technologies, and asking the right questions to drive innovation.
Adaptability — You embrace change and can pivot quickly in a fast-paced, dynamic environment without losing focus or momentum.
Effective Communication — You can clearly articulate complex technical concepts to both technical and non-technical audiences, both verbally and in writing.
Problem-Solving Mindset — You approach challenges with a structured, analytical mindset and a determination to find creative, practical solutions.
Attention to Detail — You take pride in precision and thoroughness, ensuring that your work meets the highest standards of quality.
Initiative & Ownership — You are proactive, self-motivated, and take full ownership of your projects from concept through to completion.
Resilience — You remain composed and focused under pressure, especially when navigating complex technical or organizational challenges.
Are you ready to shape the future of semiconductor technology? Join Intel's Advanced Packaging team in Arizona and be part of a world-class organization that is redefining what's possible in chip design and manufacturing. If you are passionate about innovation, thrive in collaborative environments, and want to make a lasting impact on the technology that powers the world — we want to hear from you.
Qualifications:This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
Minimum Qualifications:
Preferred Qualifications:
PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM field
6+ months of experience:
Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
Packaging process development and equipment qualification.
Analyzing process data, identifying variations, and implementing improvements.
Solid knowledge of equipment setup, calibration, and performance evaluation in manufacturing environments.
With semiconductor device fabrication and packaging process flows.
With managing complex technical projects with a focus on innovation and optimization.
Knowledge of quality systems, process documentation, and manufacturing standards.
Job Type:College Grad
Shift:Shift 1 (United States of America)
Primary Location: US, Arizona, Phoenix
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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