Job Details:
Job Description:
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:
• Developing thermal interface technology and material solutions to support Intel's future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
• Managing projects to meet product development timelines.
• Applying formal education and judgment to solve technical problems.
• Providing sustaining support for equipment performance and process health in high-volume manufacturing.
• Responding promptly to foundry customer requests and events.
The ideal candidate will demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Minimum Qualifications:
• Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience
• -OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field
• Minimum GPA of 3.5.
• At least one publication in a peer-reviewed technical journal.
Preferred Qualifications:
One or more years of experience in any of the following:
• Delivering results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technology.
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Previous related work experience in a semiconductor foundry.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
