Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology. Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry. Key Responsibilities 37 Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap. 37 Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing. 37 Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes. 37 Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity. 37 Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments. 37 Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards. 37 Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle. 37 Document advancements through white papers, technical reports, and data analysis. 37 Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: 37 Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field. 37 +4 years of experience in: 37 Process development, equipment adjustment, and manufacturing process control. 37 Design of experiments (DOE) principles and statistical data analysis. 37 Process characterization and statistical process control methodologies. 37 Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM. Preferred Qualifications 37 Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field. 37 Analytical skills and experience troubleshooting integrated technology challenges. 37 Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications. 37 Experience working with both organic and inorganic materials in packaging processes. 37 1 year of Photolithography experience. Join Intel's mission to innovate and lead in the field of advanced packaging technologies. Apply now to become part of the team shaping the future of semiconductor manufacturing. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.