Microsoft

Packaging Engineer

Microsoft • $102K — $202K *
Redmond, WA 98052In-Person
Aerospace & Defense
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Master's Degree in Electrical, Computer or Mechanical Engineering, or related field; OR Bachelor's Degree plus 2+ years experience; OR equivalent experience.
  • Ability to leverage AI tools for performance modeling, research, and automation.
  • Evaluation of AI solutions with a focus on measurable metrics and Microsoft Responsible AI guidelines.
  • Experience with cryogenic/extreme-environment hardware.
  • Proficiency in FEA tools (ANSYS, COMSOL, Abaqus, etc.) with strong simulation fundamentals.
  • Experience in correlating simulations with cryogenic test data and model iteration.

Responsibilities

  • Perform thermal and mechanical simulations for quantum packaging hardware.
  • Develop various simulation types, including hand calculations and finite-element analysis (FEA).
  • Assess packaging reliability risks, focusing on flip-chip attach and substrate bonding.
  • Generate reusable simulation templates and modeling workflows to enhance team efficiency.
  • Work collaboratively in teams or independently as needed.
  • Promote and embody company culture and values.

Benefits

  • Access to cutting-edge technology and resources in quantum engineering.
  • Opportunity to collaborate with a diverse team of engineers and scientists.
  • Potential for professional development in a pioneering industry.
  • Engagement in innovative projects that push the boundaries of technology.
Full Job Description
Overview

We are looking for a Packaging Engineer with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.

Responsibilities

  • Thermal, structural, and thermo-mechanical simulations for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.


  • Develop simulations that span hand calculations, reduced-order models, and full finite-element analysis (FEA) depending on fidelity and program needs.


  • Structural and thermo-mechanical simulations to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.


  • packaging reliability assessments, including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.


  • Generate and maintain reusable simulation templates, material libraries, and modeling workflows to improve consistency and efficiency across the packaging team.


  • Work in teams or independently as required.


  • Embody our Culture and Values


Qualifications

Required/Minimum Qualifications
  • Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field
    • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience
    • OR equivalent experience


Other Requirements

  • Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).


  • Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI


Additional/Preferred Qualifications
  • Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field
    • OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
    • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience
    • OR equivalent experience


  • Experience with cryogenic or extreme-environment hardware (cryogenic, vacuum, low-vibration, or high-precision systems).
  • Proficiency with FEA tools such as ANSYS, COMSOL, Abacus, or equivalent, including model setup, meshing strategies, and convergence assessment
  • Familiarity with advanced packaging technologies (flip chip, substrates, interposers, solder joints, PCB attach).
  • Experience correlating simulation with cryogenic test data and iterating models based on measurement feedback.
  • Strong fundamentals in heat transfer, solid mechanics, and numerical methods.
  • Demonstrated ability to translate ambiguous design questions into well-scoped simulation problems and actionable outputs.


#Quantum #QuantumCareers #MDQCareers

Hardware Engineering IC3 - The typical base pay range for this role across the U.S. is USD $102,100 - $202,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $133,800 - $219,200 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.

About Microsoft

Microsoft is an American multinational corporation that develops, manufactures, licenses, supports, and sells a range of software products and services. Microsoft’s devices and consumer (D&C) licensing segment licenses the Windows operating system and related software, Microsoft Office for consumers, and the Windows Phone operating system. The company’s computing and gaming hardware segment provides Xbox gaming and entertainment consoles and accessories, second-party and third-party video games, and Xbox Live subscriptions; surface devices and accessories; and Microsoft PC accessories. Its phone hardware segment offers Lumia smartphones and other non-Lumia phones. Its D&C segment provides Windows Store, Xbox Live transactions, and Windows phone store; search advertising; display advertising; Office 365 Home and Office 365 Personal; first-party video games; and other consumer products and services as well as operating retail stores. Microsoft’s commercial licensing segments license server products, including Windows Server, Microsoft SQL Server, Visual Studio, System Center, and related Client Access Licenses (CALs); Windows Embedded; Windows operating system; Microsoft Office for business, including Office, Exchange, SharePoint, Lync, and related CALs; Microsoft Dynamics business solutions; and Skype. Its commercial segment offers enterprise services, including premier support services and Microsoft consulting services; commercial cloud comprising Office 365 Commercial, other Microsoft Office online offerings, Dynamics CRM Online, and Microsoft Azure; and other commercial products and online services. The company markets and distributes its products through original equipment manufacturers, distributors, and resellers, as well as online.

Microsoft Careers

Join Microsoft today and be part of a company that values innovation, leadership, and diversity in its workforce. As a global leader in technology and digital transformation, Microsoft offers unparalleled job opportunities that propel your career to new heights.

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Learn more about Microsoft
Size
181,000 employees
Market Cap
$1,762.4 billion
Industry
Enterprise Technology
Net Income
$51.3 billion
Founded
1975
5 Year Trend
+15.5%
Revenue
$153.2 billion
NASDAQ
MSFT
* Ladders Estimates

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