Summary of Role GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies.
The engineer will contribute to thermal, mechanical, electrical, and optical design integration activities, including design rule development, simulation/modeling support, manufacturability assessments, and reliability-focused design characterization. This role offers hands-on exposure to next-generation packaging solutions while building technical depth in silicon photonics, advanced packaging design, and engineering analysis.
Essential Responsibilities include: - Support packaging design integration activities for silicon photonics and advanced packaging products.
- Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.
- Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
- Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.
- Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.
- Support development and documentation of design guidelines, technical reports, and presentation materials.
- Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.
- Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.
Other Responsibilities - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Travel up to 10% to other GlobalFoundries facilities may be necessary. HM to confirm whether this should remain in posting.
Required Qualifications - Education - Graduating with a Bachelor's, Master's, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program. HM to confirm final education level and majors.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.
- Demonstrated analytical and problem-solving skills.
- Experience analyzing experimental, simulation, or engineering data.
- Ability to work effectively within cross-functional teams.
- Language Fluency - English (Written & Verbal).
- Travel - Up to 10%. HM to confirm or remove.
Preferred Qualifications - Prior related internship, co-op, research, or academic project experience in advanced packaging, silicon photonics, chip package interaction, thermal/mechanical/electrical/optical design, reliability engineering, or process integration.
- Familiarity with design or modeling tools such as HFSS, Zemax/Zmax, FloTHERM, finite element analysis, electrical simulation, optical simulation, or related engineering software. HM to confirm final tool names and whether these should be required or preferred.
- Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.
- Familiarity with Design of Experiments (DOE), engineering statistics, or data analysis methods.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.
- Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
#NCGProgramUS Expected Salary Range$85,000.00 - $146,000.00
The exact Salary will be determined based on qualifications, experience and location.
