NXP Semiconductors

Package Thermal & Mechanical Simulation Engineer

NXP Semiconductors • $100K — $120K *
Austin, TX 78745In-Person
Manufacturing & Automotive
Less than 5 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Master's or Ph.D. in Mechanical Engineering or equivalent required.
  • Experience with Finite Element Modelling, preferably Ansys or Marc Mentat.
  • Fluency in English needed.
  • Preferred understanding of semiconductor packaging technologies.
  • Ability to work on-site at least 3 days a week.

Responsibilities

  • Collaborate as part of the on-site Package Innovation simulation team on engineering questions.
  • Support risk mitigation and design optimization with product development teams and package project leads.
  • Assist in troubleshooting package-related issues during lifetime testing.
  • Analyze thermal performance of products.

Benefits

  • Opportunity to work within a globally present team.
  • Engagement in diverse project collaborations across multiple departments.
  • Hands-on experience with cutting-edge semiconductor packaging technologies.
Full Job Description
Your responsibilities
  • Be a part of the on-site Package Innovation simulation team at NXP Austin and collaboratively solve engineering questions for package development projects.
  • Collaborate with product development teams and package project leads in support of risk mitigation and design optimization.
  • Support problem-solving of package related issues during lifetime testing.
  • Analyze thermal performance of products.


Your team

The modelling team's responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in Austin. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.

Your profile

To be successful in this role you have:
  • A Master or Ph.D. degree qualified in Mechanical Engineering or equivalent is required
  • Experience with Finite Element Modelling, preferably with Ansys or Marc Mentat
  • Fluent in English
  • Understanding of semiconductor packaging technologies is preferred.
  • Willingness to be present on site for at least 3 days/week


Furthermore, you are:
  • An excellent communicator, teamplayer, influencer and networker.
  • A self-starter with initiative, flexibility and command skills.


More information about NXP in the United States...

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About NXP Semiconductors

NXP Semiconductors N.V. is a Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $8.88 billion in 2020. The company's products are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. NXP is the co-inventor of near field communication (NFC) technology along with Sony and supplies NFC chip sets that enable mobile payments, as well as secure access to cars and buildings.
Learn more about NXP Semiconductors
Size
31,000 employees
Market Cap
$39.8 billion
Industry
Manufacturing & Automotive
Net Income
$52 million
Founded
1953
5 Year Trend
+3.1%
Revenue
$8.6 billion
NASDAQ
NXPI
* Ladders Estimates

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