Qualcomm

Package Design Engineer - Up to Staff level

Qualcomm$154K — $252K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • Master's degree in electrical, mechanical engineering, material science, or related field with 5+ years of experience.
  • Proficient in Cadence APD & SiP tools.
  • Familiar with high-speed IO interfaces and electromagnetic field principles.
  • Experienced in IC packaging structures and chip-package interaction.
  • Basic knowledge in electronic packaging processes and failure modes.

Responsibilities

  • Drive advanced package selection and configuration optimization.
  • Conduct physical design/layout and optimization for Package/SIP.
  • Collaborate with multi-functional teams to enhance chip performance.
  • Oversee the physical design of packages/modules for SoCs.
  • Coordinate design and feasibility analyses with cross-functional groups.
  • Develop strategies for design verification and automation in package design.
  • Work to optimize package pin out for efficiency.

Benefits

  • Competitive annual discretionary bonus program.
  • Opportunities for annual RSU grants.
  • Comprehensive benefits to support work-life balance.
Full Job Description
Job Area:
Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

Role and Responsibilities:
  • Own and drive advanced package selection, new generation product package structure, and configuration optimization.
  • Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
  • Work with multi-functional teams to achieve optimized mechanical, electrical, and thermal performance for various types of chips.
  • Implement the physical design of packages and modules for SoC.
  • Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
  • Work multi-functionally to optimize package pin out.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tools, design, and verification flow.
  • Partner with BU PD team to optimize chip Floorplan and bump placement and optimize the package size.


Skills:

As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
  • Proficient in Cadence APD & SiP.
  • Basic knowledge in high-speed IO interfaces and electromagnetic field.
  • Knowledge of IC packaging structures, chip-package, and package-board interaction.
  • Basic knowledge of electronic packaging process and typical failure modes preferred.


Preferred Qualifications:
  • Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
  • Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
  • Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
  • Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
  • Experience with Calibre tool and package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
  • Solid understanding of Design Rules Check and Design for Manufacturing.


Pay range and Other Compensation & Benefits:
$154,000.00 - $252,800.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

About Qualcomm

Qualcomm Ventures is the investment arm of Qualcomm Incorporated. Founded in 2000, Qualcomm Ventures is a corporate venture capital fund with over 150 active portfolio companies and more than 20 exits over a billion dollars, including 99 Taxis, Cruise Automation, Fitbit, Invensense, NQ Mobile, Waze, and more. As a global investor, Qualcomm Ventures helps connect entrepreneurs to the resources, relationships, and deep industry expertise they need to succeed in the mobile technology ecosystem.

Qualcomm Careers

Joining Qualcomm offers more than just a job opportunity; it's a gateway to a career infused with innovation, leadership, and growth. As a pivotal leader in the world of wireless technology, Qualcomm stands at the forefront of digital communication advancements. Our team of professionals is dedicated to pushing the boundaries of what's possible, making this an ideal time to become part of our global community.

Work You’ll Do

At Qualcomm, you will collaborate with some of the brightest minds in the industry, engaging in work that transforms the way the world connects, computes, and communicates. Our diverse team is driven by a shared passion for creating path-breaking wireless technologies that empower mobile ecosystems worldwide.

Innovate and Grow

Embrace the opportunity to innovate alongside leaders in the field and contribute to projects that have a global impact. Qualcomm is committed to fostering a culture of innovation and continuous improvement, ensuring that every team member has the opportunity to make a significant impact.

Professional Growth and Development

Qualcomm is dedicated to the professional growth of its employees, offering unparalleled benefits, diverse career paths, and extensive training programs that encourage professional and personal development. Whether you're looking for leadership roles or specialized technical positions, Qualcomm provides the resources and support to help you drive your career forward.

Diversity and Inclusion

We believe that a diverse workforce fuels our innovation and reflects our commitment to making a positive impact. Qualcomm’s inclusive culture and diversity training programs are designed to promote an environment where all employees can thrive.

Internship Programs

Start your career with Qualcomm through our dynamic internship programs. These opportunities allow you to apply your skills in real-world scenarios, providing a robust foundation for future employment. Internships at Qualcomm are characterized by meaningful projects and the chance to network with industry leaders.

Join Our Team

Explore the numerous job opportunities at Qualcomm, from engineering to marketing, and discover how your skills and interests align with our mission. We are continuously hiring creative and driven individuals who are ready to contribute to our culture of innovation.

Prepare for Your Interview

Ready to join our team? Prepare your resume to highlight your relevant experience and skills. Our interview process is designed to understand your capabilities and how they align with our goals at Qualcomm. We look for passionate, curious, and innovative team players who are ready to take the next step in their careers.

Stay Connected

Keep up to date with the latest at Qualcomm by following our careers blog. Gain insider perspectives and industry-leading insights that can help you navigate your professional journey.

Career Opportunities Await

At Qualcomm, your career is what you make of it. With support for your ambitions and a network of global professionals, the opportunities to advance and excel are nearly limitless. Join us and be part of a team that’s leading the world in next-generation technology.

Search Qualcomm Jobs

Discover the positions that match your skills and interests. We are looking for individuals who are ready to make an impact and excel in a fast-paced, innovative environment.

Explore Qualcomm Careers

Whether you're seeking an internship, a first job, or a leadership position, Qualcomm offers a range of opportunities across various disciplines. Let your career journey begin here, where innovation, leadership, and growth come together to create extraordinary outcomes.
Learn more about Qualcomm
Size
45,000 employees
Market Cap
$122.5 billion
Industry
Net Income
$6.7 billion
Founded
1985
5 Year Trend
+14.7%
Revenue
$26.6 billion
NASDAQ

Similar Jobs

More Jobs at Qualcomm

More Consumer Technology Jobs

Find similar Package Design Engineer - Up to Staff level jobs: