Primary Responsibilities:
- Responsible for providing optimized package design solutions for New Product and New Technology Introductions (NPI, NTI).
- Define packages that meet product requirements for electrical performance, manufacturability, and cost.
- Run Electromagnetic (EM) modeling tools to ensure package performance and document modeling results.
- Work with business line System on Chip (SoC) and Printed Circuit Board (PCB) teams to optimize the performance of package solutions.
- Provide electrical design rules to Package Design Layout (PDL) team and work with PDL to optimize the package layout using electrical modeling data to improve IO interface and power performance.
- Provide package electrical data or models to BL team for system level simulation.
Job Qualifications:
- MSEE+ with experiences in microelectronics packaging design and EM modeling or related field required.
- EM educational background, proficient on EM modeling and simulation tools (HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence Signal and power integrity tools) is strongly preferred.
- Radio Frequency (RF) design experience, RF and multiple GHz wired & wireless modeling experience, and antenna modeling experience are preferred.
- Understand electrical design of various IO interfaces (e. g. LVDS, DDR, SerDes) used in semiconductor industry.
- PCB design experience or worked with PCB designer is preferred.
- Knowledge on die level Back End of Line (BEOL) design is a plus.
- Team player with positive attitude, self-driven proactive mindset, and innovative outlook.
- Excellent written and verbal communication and presentation skills are required.
- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
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