Ciena

Optoelectronic IC Package Design Director

Ciena$235K — $376K *
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • BS in Electrical Engineering or Physics; advanced degrees preferred
  • 10+ years of hands-on experience in IC package design

Responsibilities

  • Own and drive advanced package selection and BGA configuration
  • Manage package development schedules
  • Oversee package layout, SI/PI optimization, and design verification
  • Coordinate with cross-functional teams on package selection and feasibility
  • Optimize silicon floor plan, bump, and package pin out
  • Simulate and optimize signal and power integrity of package designs
  • Collaborate with CMs and vendors for design sourcing and development

Benefits

  • Comprehensive medical, dental, and vision plans
  • 401(K) with company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Company-paid holidays, paid sick leave, and vacation time
  • Paid Family Leave and other leaves of absence compliance
Full Job Description
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules.

How You Will Make an Impact:
  • Own and drive advanced package selection, new product BGA configuration, and package structure
  • Own and manage package development schedules
  • Responsible for package layout, SI/PI optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
  • Simulate and optimize signal and power integrity and RF performance of the package design
  • Interface and work with CMs and vendors for sourcing existing designs and future product development


The Must Haves:
  • BS in Electrical Engineering or Physics (master's or Ph. D degree is a plus)
  • 10+ years hands on experience with IC package design experience


The Nice to Haves:
  • Substrate design experience for RF, digital, high speed and mixed signal designs
  • Thorough understanding of signal and power integrity fundamentals
  • Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
  • Experience in package design electrical review, SI/PI analysis
  • Experience in package design for manufacturing reviews
  • Experience in thermal and mechanical design is a plus
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
  • Problem solver with strong engineering fundamentals


Pay Range: The annual salary range for this position is $235,600 - $376,400.

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.

About Ciena

Ciena Corporation is a global supplier of telecommunications networking equipment, software, and services. The company was founded in 1992 and is headquartered in Hanover, Maryland. Ciena's products include optical transport and switching systems, software, and services that support the transport, switching, aggregation, and management of voice, video, and data traffic. Ciena serves customers in the telecommunications industry, including telecommunications service providers, cable operators, governments, and enterprises. The company has approximately 7,000 employees worldwide and operates in more than 100 countries.
Learn more about Ciena
Size
7,241 employees
Market Cap
$7.3 billion
Industry
Net Income
$354.3 million
Founded
1992
5 Year Trend
+5.3%
Revenue
$3.4 billion
NASDAQ

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