We are seeking a senior NAND Product/Test Development Engineer and technical leader to drive test strategy and innovation for next-generation NAND Flash memory products. This role is responsible for leading burn-in or high-speed I/O test development, guiding junior engineers, and driving cross-functional projects across Design, Process, Reliability, Manufacturing, and SSD teams. The successful candidate will influence product quality, reliability, test cost, and technology roadmap decisions while enabling industry-leading QLC and PLC NAND solutions for AI-driven datacenter storage applications. Major Responsibilities • Lead the development and optimization of burn-in, reliability screening, and high-speed I/O test methodologies for NAND Flash products. • Drive electrical validation, test coverage improvement, yield enhancement, and test cost reduction initiatives across NAND products. • Lead root cause investigations of complex test and product failures through statistical analysis, electrical failure analysis, and cross-functional collaboration. • Provide technical leadership for new product introduction (NPI), test program development, qualification, and manufacturing ramp. • Lead cross-functional projects involving Design, Process, Reliability, Manufacturing, OSAT, and SSD engineering teams. • Mentor and guide junior engineers on test methodology development, failure analysis, data interpretation, and technical problem solving. • Define and drive backend test roadmap initiatives, including test time reduction, screening optimization, and next-generation test technology deployment. • Work closely with SSD engineering teams to enable NAND component and SSD system co-optimization for quality and reliability improvements. Qualifications • Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuits, or related fields. • 5+ years of experience in NAND, memory product engineering, test engineering, or reliability engineering. • Strong knowledge of statistical data analysis, electrical failure analysis, and semiconductor test methodologies. • Experience with NAND Flash architecture, burn-in screening, high-speed I/O testing, and manufacturing test optimization preferred. • Demonstrated technical leadership and ability to lead cross-functional projects and mentor engineers. • Strong communication, collaboration, and problem-solving skills. Additional Information This position is also eligible to participate in Solidigm's restricted stock unit (RSU), restricted cash unit (RCU), and cash bonus programs. In addition, Solidigm offers a benefits package that includes medical, dental, vision, supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts, and a company match on eligible 401(k) plan contributions. The compensation range for this role is $121,280 - $194,100. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.