Job Details:Job Description:The Role and ImpactAs a Module Development Engineer, you will play a key role in advancing Intel's semiconductor manufacturing technologies. You will lead the development, optimization, and integration of advanced manufacturing processes and metrology solutions that enable next-generation products. Working closely with cross-functional teams and industry-leading suppliers, your contributions will directly support high-volume manufacturing, technology innovation, and Intel's long-term roadmap.
Key Responsibilities- Develop, optimize, and integrate advanced manufacturing processes, including material selection, process parameter optimization, and equipment metrology.
- Lead pathfinding activities to support the development of innovative process for next-generation products.
- Partner with equipment and material suppliers to evaluate and incorporate enabling technologies into Intel's manufacturing environment.
- Drive process and equipment improvements to enhance performance, yield, efficiency, and manufacturability.
- Monitor industry trends and emerging technologies to help shape Intel's future manufacturing strategies and cost-effective technology roadmaps.
- Collaborate with cross-functional teams to ensure process compatibility across upstream and downstream manufacturing operations.
- Apply Statistical Process Control (SPC), Design of Experiments (DOE), and data-driven methodologies to solve complex technical challenges.
Qualifications:Minimum Qualifications- Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field with 3+ years of relevant industry experience; OR
- PhD in the same fields with 1+ years of relevant experience.
- Strong knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE).
- Experience with semiconductor processing, system controls, and material processing.
Preferred Qualifications- Demonstrated ability to troubleshoot and resolve complex manufacturing process and equipment challenges.
- Experience in advanced packaging technologies, including wafer-level assembly, epoxy and mold materials, annealing processes, or related areas.
- Strong analytical and problem-solving skills, with the ability to prioritize and manage multiple projects simultaneously.
- Proven ability to collaborate effectively across diverse technical teams in a fast-paced environment.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
