Qualifications

• Bachelor's degree in Electrical Engineering, Electronics Engineering, Materials Science, or related field; Master's or PhD preferred.
• Minimum 5 years of experience in microelectronics fabrication or semiconductor manufacturing.
• Proven experience in RF technology support (e.g., GaAs, GaN, or SiGe technologies).
• Several years in a leadership or management role overseeing engineering teams.
• Deep understanding of cleanroom operations, photolithography, etching, and deposition processes.
• Proficiency in RF design tools and measurement equipment (Network Analyzers, Spectrum Analyzers).
• Experience with Statistical Process Control (SPC) and Design of Experiments (DoE).

Responsibilities

• Lead and manage a multidisciplinary team of electronics, electrical, and materials engineers.
• Oversee the end-to-end development of microelectronic components and fabrication processes.
• Ensure microelectronic designs are optimized for RF support including signal integrity and impedance matching.
• Develop and approve test procedures for validation at wafer and package levels, ensuring transition to production.
• Drive continuous improvement initiatives to enhance cycle time and reduce defect rates.
• Manage field-testing of integrated systems in real-world RF environments.
• Manage budget allocations and mentor junior engineers to foster growth.

Benefits

• Dynamic work environment focusing on innovation in microelectronics and RF technology.
• Opportunity for career advancement and professional growth in a leadership role.
• Access to state-of-the-art laboratory equipment and resources for engineering development.
• Culture of continuous improvement with a focus on operational excellence.