MEMS Wafer Integration Engineer
Description -Job SummaryThe MEMS organization is looking for an Expert level Silicon Wafer Fabrication Integration Engineer. This role is responsible for the end-to-end integration of silicon wafer fabrication processes supporting new technology development and manufacturing readiness. This role drives process integration strategies across photolithography, deposition, etch, metrology, and other semiconductor fabrication modules to deliver robust, manufacturable, high-performing, and reliable products.
The engineer works closely with process engineering, product engineering, design, quality, reliability, operations, and worldwide manufacturing partners to identify risks, solve complex technical issues, and accelerate technology development through qualification and production readiness.
Responsibilities- Define, develop, and optimize wafer process flows across multiple fabrication modules
- Lead cross-functional teams to resolve integration, yield, reliability, and quality challenges
- Drive characterization plans, design-of-experiments (DOE), process qualifications, and technology demonstrations
- Evaluate interactions between process modules and identify integration risks, tradeoffs, and mitigation strategies
- Support technology transfers to internal or external manufacturing sites
- Lead technical reviews, integration meetings, and project execution plans
- Collaborate with worldwide engineering teams to align process capabilities and manufacturing readiness
- Provide technical leadership during fab escalations, root-cause investigations, and corrective action implementation
Education & Experience Recommended- Bachelor's or Advanced Degree in Material Science, Engineering, or Physical Sciences
- 10 + years of experience in semiconductor, MEMS, or microfabrication process development and integration
- Strong understanding of semiconductor fabrication processes including photolithography, thin film deposition, dry and wet etch, cleaning processes, and metrology and defect inspection
Knowledge & Skills- Demonstrated ability to solve complex technical problems using structured engineering methods
- Experience with DOE, SPC, data analysis, and yield improvement methodologies
- Project management skills
- Strong written and verbal communication skills - ability to give clear and effective presentations to inform and persuade peers and managers
- Proven ability to work effectively in cross-functional and global teams.
The pay range for this role is
$116,150 to
$182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -Engineering
Schedule -Full time
Shift -No shift premium (United States of America)
Travel -Relocation -
