MEMS Engineering Manager 1

HP Development Company, L.P.$130K — $205K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5+ years of experience in MEMS process engineering or related field
  • Proven leadership skills in managing engineering teams
  • Strong understanding of MEMS fabrication technologies
  • Experience with lean development methodologies and process optimization
  • Excellent communication and collaboration abilities with cross-functional teams

Responsibilities

  • Manage a MEMS process/product development engineering team
  • Lead the development of new MEMS processes and tooling capabilities
  • Ensure timely delivery of MEMS processes meeting performance targets
  • Establish and maintain a process technology roadmap for the team
  • Support efficient fab operations through strong relationships with operations teams
  • Define and manage team objectives linked to organizational goals
  • Conduct employee performance evaluations and employee development

Benefits

  • Comprehensive health, dental, and vision insurance
  • Long term and short term disability insurance
  • Generous parental leave policy
  • 11 paid holidays and flexible paid vacation
  • Employee assistance program and flexible spending account
  • Life insurance
Full Job Description
MEMS Engineering Manager 1

Description -

Major Responsibilities:

This manager will be responsible for a MEMS process/product development engineering team that innovates, characterizes, and stabilizes fabrication processes used to produce inkjet components and other microfluidic devices. Our fab uses a variety of processes including traditional photo, deposition, etch, and bond technologies as well as less common micromachining and packaging methods. The Manager in this role will be responsible for setting strategy for the team, defining team objectives, establishing and delivering to project schedules, hiring, and developing the engineering staff. With the engineering team, the manager will deliver to the following key objectives:

Provide new Capability & Capacity for MEMs processing
  • Lead the development of new MEMS processes and tooling capabilities to support next generation product development (G5, G5-industrial, and LCS)
  • Ensure on time delivery of MEMs processes with acceptable R&R's, controls and safety to meet/exceed the performance targets as defined by the various technology roadmaps and product requirements
  • Collaborate with product development teams and other key partners to ensure development deliverable are on track and prioritized.
  • Drive improvements to meet or exceed POR commitments (capacity, process cycle time, yield and cost)


  • Establish and maintain a process technology roadmap for the team.
  • Incorporate Lean Development Methodologies (LPPD, lean problem solving, etc)
  • Ensure successful completion of process and technology transfers to HP-Malaysia and HP-Singapore. Manage process convergence with those High Volume Manufacturing sites.
  • Support efficient Fab operation through excellent relationships with Operations
  • Provide direction for the Workcenters as the Engineering Management Sponsor
  • Manage the Equipment Strategy for these areas to meet the technology and capacity needs (manage vendors, equipment obsolescence, equipment capability and capacity)


Perform all necessary HP management duties including:

  • Establish prioritized team objectives and communicate how they link to key organizational objectives, product portfolio, and technology roadmaps
  • Work with product development teams to translate new product specifications into manufacturable designs
  • Develop and manage resource plans
  • Set and deliver to department budgets, participate in the Lab's budget planning process
  • Define program schedules, define priorities, make appropriate project trade-offs
  • Deliver employee performance evaluations, performance management processes, work to develop employees, provide ongoing feedback to engineers


The pay range for this role is $130,700 to $205,200 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:
  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)


The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -
Engineering

Schedule -
Full time

Shift -
No shift premium (United States of America)

Travel -
Not Specified

Relocation -
No

About HP Development Company, L.P.

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