Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:This position involves developing and supporting mechanical designs for advanced packaging & optical components and systems. The mechanical engineer will collaborate closely with cross-functional engineering teams to capture product concepts, document component, and process flows, and perform analytical studies on material and packaging design that meets final product requirements.
Responsibilities:- Design and develop advanced packaging solutions using CAD tools (primarily SolidWorks), including detailed 3D models and 2D engineering drawings that meet industry standards and internal guidelines.
- Collaborate closely with manufacturing and operations teams to ensure successful implementation of packaging designs, providing hands-on engineering support during production ramp and issue resolution.
- Document component flow across assembly, test, and packaging processes to support design decisions and manufacturing readiness.
- Support material and package selection, including epoxies, mechanical housings, and other structural components, with consideration for performance, reliability, and manufacturability.
- Perform mechanical analyses such as thermal, structural, strain, and root-sum-square (RSS) tolerance analysis to ensure robustness and reliability of package designs.
- Create clear visualizations and renderings for design reviews, technical discussions, and stakeholder presentations.
- Contribute to continuous improvement of engineering documentation, design standards, and development workflows.
Qualifications:- Bachelor's degree in Mechanical Engineering, Materials Engineering, or a related field, with 3+ years of experience in semiconductor advanced packaging and design.
- Strong proficiency in SolidWorks for 3D modeling and 2D drafting; experience with SolidWorks Visualize or similar rendering tools preferred.
- Solid understanding of mechanical design principles, materials behavior, and design for assembly and manufacturability (DFM/DFA).
- Experience performing thermal and structural analyses; familiarity with Ansys or equivalent multiphysics simulation tools is a plus.
- Working knowledge of JEDEC and other relevant packaging standards.
- Strong understanding of packaging materials, manufacturing processes, and quality/regulatory requirements.
- Proficient in Microsoft Office tools for documentation, reporting, and presentations.
- Excellent communication, documentation, and cross-functional collaboration skills.
- Proven ability to manage multiple projects, work independently, and meet deadlines in a fast-paced environment.
- Strong analytical thinking and problem-solving skills.
