Advanced Micro Devices, Inc

Mechanical Engineer

Advanced Micro Devices, Inc • $110K — $130K *
San Jose, CA 95123In-Person
Technical Services
Less than 5 years of experience
Today
Be an Early Applicant
Job Overview by Ladders

Qualifications

  • 5-7 years of semiconductor packaging experience in ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products
  • Proficient in mechanical design, CAD modeling, GD&T, and tolerance analysis
  • Experience with manufacturing feasibility (DFM) and design reviews
  • Familiar with thermo-mechanical modeling using ANSYS Mechanical or similar software
  • Understanding of chip-package and package-board interactions
  • Proven experience collaborating with suppliers and manufacturing partners
  • Knowledge of advanced packaging technologies, cooling solutions, and new material technologies is a plus

Responsibilities

  • Develop advanced semiconductor packaging solutions for cutting-edge AI and HPC products
  • Drive mechanical design processes including CAD modeling and tolerance analysis
  • Collaborate with suppliers and manufacturers to ensure manufacturable packaging solutions
  • Review and evaluate designs and engineering changes for quality assurance
  • Support thermo-mechanical modeling and integration of packages using advanced simulation tools
  • Contribute to integration efforts across chip, package, and system levels
  • Work with cross-functional teams throughout product development and launches
  • Advance cooling and materials technologies for future AMD products

Benefits

  • Comprehensive AMD benefits package
  • Health and wellness programs
  • Professional development opportunities
  • Collaborative work environment
  • Exposure to cutting-edge technologies
Full Job Description
THE ROLE:

AMD's Advanced Packaging team is developing next-generation packaging and cooling solutions that enable industry-leading AI, HPC, FPGA, ASIC, and SoC products. In this role, you will work closely with packaging architects, suppliers, and manufacturing partners to develop mechanical solutions for advanced semiconductor packages, helping drive designs from concept through production.

This is a highly collaborative position with strong exposure to advanced packaging technologies, supplier engagement, manufacturability, and future platform development.

THE PERSON:

You are a hands-on mechanical engineer with semiconductor packaging experience and a strong foundation in mechanical design, modeling, and product development. You enjoy working with suppliers, reviewing designs, solving technical challenges, and helping bring new technologies into production.

You thrive in a cross-functional environment and can effectively balance technical execution, manufacturability, and product requirements.

KEY RESPONSIBILITIES:
  • Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
  • Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews.
  • Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
  • Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability.
  • Support thermo-mechanical modeling and package integration activities using tools such as Creo and ANSYS Mechanical.
  • Contribute to chip, package, board, and system-level integration efforts.
  • Partner with packaging, thermal, reliability, manufacturing, and supply-chain teams throughout product development and ramp.
  • Support development of next-generation packaging, cooling, and materials technologies for future AMD products.

REQUIRED QUALIFICATIONS:
  • Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products.
  • Experience with mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
  • Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools.
  • Understanding of chip-package interaction, package-board interaction, and semiconductor package integration.
  • Experience working with suppliers, contract manufacturers, or packaging development partners.
  • Knowledge of advanced packaging technologies and manufacturing processes.
  • Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials is a plus.

ACADEMIC CREDENTIALS:
  • MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or related technical field. Equivalent industry experience may be considered.

This role is not eligible for visa sponsorship.
#LI-DR2

Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

Work You’ll Do

At AMD, we offer job opportunities that push the boundaries of what is possible. Our team is composed of professionals who lead the way in microprocessor and graphics technology, driving industry standards and innovation. With AMD, you will be part of a culture that values growth and professional development, ensuring that every team member has the opportunity to excel.

Transform Your Career

AMD is not just about advancing technology, but also about advancing careers. Whether you are looking for an internship, a full-time position, or leadership roles, AMD provides the platform to propel your career to new heights. Our commitment to professional growth is matched by our dedication to diversity and inclusion, making AMD a place where everyone can thrive.

Innovative Work Environment

Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

Career Development and Benefits

AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

Explore Job Opportunities

From engineering to marketing, AMD offers a range of career paths that cater to diverse skills and interests. Our hiring process is designed to be transparent and engaging, helping you to understand where you fit within our team and how you can contribute to our collective goals.

Stay Connected

Join Our Team Search open positions that match your skills and interest. We look for passionate, curious, creative, and solution-driven team players. Explore the opportunities to join a company that’s committed to your career growth and to innovation in the technology sector.

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Interview and Resume Tips

Prepare for your future with AMD by accessing resources that help you craft your resume and excel in interviews. Our goal is to help you showcase your best professional self and align your skills with the needs of our dynamic team. At Advanced Micro Devices, Inc., we empower our employees to innovate, lead, and grow. Join us in driving the future of technology while building a rewarding and sustainable career.
Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Manufacturing & Automotive
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ
AMD
* Ladders Estimates

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