Manufacturing Engineer

Stellant Systems

$80K — $130K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's Degree in Materials, Chemical, Mechanical, Electrical, or Electronic Engineering.
  • Experience in manufacturing engineering of PCBAs, microelectronics or similar processes.
  • Extensive knowledge of Eutectic die attach and wire-bonding technologies.
  • Good analytical and problem-solving skills.
  • Ability to work under a microscope with fine dexterity.

Responsibilities

  • Assist production team in mastering die-bonding and wire bonding techniques.
  • Qualify new products and product lines at the Torrance site.
  • Collaborate with cross-functional teams to create wire bond solutions.
  • Train staff on die-assembly, wire bond technology, and troubleshooting techniques.
  • Ensure adherence to quality standards in microelectronic assembly.

Benefits

  • Hands-on experience in microelectronics assembly processes.
  • Opportunity to lead high-visibility projects.
  • Dynamic work environment encouraging self-starter mentality.
  • Collaboration with multifaceted teams for innovative solutions.
  • Professional growth in a specialized engineering field.
Full Job Description
Overview

Job Title: Manufacturing Engineer

Job Location: Torrance, CA

Salary: $80,000-$130,000/yr Depending on experience and level

 

We are seeking a motivated engineer with hands-on experience in microelectronics assembly to play a critical role at our facility in Torrance, CA. This role offers a unique opportunity to combine technical acumen with project leadership skills. The ideal candidate is a self-starter, comfortable working in a dynamic environment, and eager to take on a key role in highly visible projects.

Responsibilities
  • Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
  • Qualify new products and new product lines at Torrance production site.
  • Collaborate with other functional groups to develop wire bond solutions to meet business needs.
  • Provide training in die-assembly, wire bond technology, problem analysis and resolution.
  • Must have knowledge and understanding of:
  • Ability to work under a microscope for extended periods of time
  • Ability to have eye to hand dexterity and fine motor skills
Qualifications

This role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.

  • Level II: requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
  • Level III: requires a minimum of 4 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
  • Level IV: requires a minimum of 6 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.

Role also requires:

  • Bachelor’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering.
  • Extensive experience with Microelectronic device process development including Eutectic die attach, precision pick and place and wire-bonding machines. Good analytical and problem-solving skills
  • Self-motivated, able to work independently and self-initiative personality
  • Possesses good communication skills, interpersonal skills and ability to work with multi-functional teams

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