Job Summary GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part of our Quantum Advanced Packaging team. This role will entail enabling next-generation assembly scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners. The primary responsibility of this position is to develop low-temperature bonding processes, support advanced die assembly technologies, and associated assembly equipment. The engineer will drive process characterization, tool optimization, defect reduction, and integration activities required to support next-generation superconducting and cryogenic quantum packaging platforms.
Essential Responsibilities - Develop and optimize low-temperature bonding processes for quantum packaging applications.
- Support assembly process development (In bonding, superconducting metal bonding, thermo-compression bonding, hybrid bonding, etc.)
- Characterize bond quality, electrical performance, mechanical integrity, and reliability through cryogenic operating conditions.
- Define process windows and critical-to-quality parameters for production-worthy assembly processes.
- Own assembly process modules from development through qualification.
- Execute process experiments and DOE activities to improve process capability and robustness.
- Work with test and systems teams to ensure assembled hardware meets:
- Cryogenic reliability across thermal cycles
- Electrical and RF/microwave integrity requirements
- Work with equipment teams to define requirements for:
- High-precision alignment / bonding tools
- Cryogenic-compatible materials handling
- Develop deep understanding of tool capability vs. quantum packaging requirements.
- Contribute to APPC / Quantum packaging roadmap and capability build-out.
- Provide clear technical updates, data analysis, and reports to stakeholders.
- Support IP generation, publications, and conference contributions.
Other Responsibilities: - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Take part in hiring of other Advanced Packaging team members.
- Mentor and guide new hires to assume their roles and responsibilities.
- Other duties as assigned by manager.
Required Qualifications: - Education - Bachelor's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
- BS degree with at least 4 years of prior related work experience.
- In depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
- Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
Preferred Qualifications: - Education - MS education level preferred with at least 2 years of prior related work experience.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
Expected Salary Range$85,000.00 - $146,000.00
The exact Salary will be determined based on qualifications, experience and location.
