Job Responsibilities include but are not limited to:
1. Process Flow Development
• Develop and define integrated front end process flows for new technology nodes.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
• Establish process windows and integration schemes.
2. Yield and Defect Reduction
• Analyze yield loss and parametric failures.
• Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
• Drive corrective actions to improve yield and cycle time.
3. Device Performance Optimization
• Ensure electrical parameters meet design targets.
• Work closely with device engineers to tune process conditions.
• Optimize critical dimensions (CD), overlay, and film thickness.
4. Process Control and Monitoring
• Implement control plans and process monitoring strategies.
• Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis
5. Technology Transfer
• Support ramp from RnD to high-volume manufacturing (HVM).
• Document process specifications and standard operating procedures (SOPs).
6. Cross-Functional Collaboration/Work with
• Device Engineering
• Equipment Engineering/Module Engineering
• Yield Engineering
• Reliability Teams
• Design Teams

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
•Candidate must possess a PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.

•Candidate must possess at least one of the following:
6+ months experience on one or more of the following areas:
o Semiconductor device fabrication or nanotechnology.
o Electrical characterization of transistors or other semiconductor devices.
o Clean room process development.

Preferred Qualifications:
• JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
• Strong understanding of Device physics (CMOS, FinFET, GAA, etc)
• Hand on experience in VLSI device fabrication and testing in the lab.
• Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)
• Understanding statistical process control and charting methodology data flow and integrity. Strong data analysis and presentation acumen.
• Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
• Knowledge of automation and defect classification systems in a fab environment.
• Strong stakeholder management and influencing skills. Experience in coordination with other departments, co-workers, etc.

Interview Tips here.
By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Benefits at Intel

Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

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