Advanced Micro Devices, Inc

Integrated Circuit Packaging Architect

Advanced Micro Devices, Inc$130K — $180K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • 5-10 years experience in semiconductor technology development
  • Leadership in engineering teams focused on architecture and process definition
  • Strong background in yield improvement techniques
  • Excellent oral and written communication skills
  • BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, or Electrical Engineering

Responsibilities

  • Collaborate with product architects to define package architectures and roadmaps
  • Lead new package technology development from concept to qualification
  • Drive design rules and DFM/DFY guideline establishment through test vehicle design
  • Establish and implement a yield roadmap with data analytic tools
  • Communicate technology development progress to executive teams

Benefits

  • Comprehensive health and wellness programs
  • Flexible work arrangements including hybrid options
  • Professional development opportunities
  • Collaborative work environment with cross-functional teams
Full Job Description
The Role:

Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.

The Person:

The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management

Responsibilities:
  • Work with product architects in early definition stage to understand and define package architectures, roadmap
  • Lead new package technology development initiatives from concept to full technology qualification
  • Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
  • Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Preferred Experience:
  • Experience in semiconductor technology development role
  • Experience working with manufacturing partners such as suppliers, OSATs and foundry partners.
  • In-depth knowledge in material science, thin film process development, and/or packaging
  • Experience in a leadership role driving cross-functional teams
  • Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment

Education:

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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