Nokia

Head of Intra Data Center Platforms

Nokia • $150K — $200K *
US-Anywhere
+ 2 other locationsRemote
Telecommunications & Hardware
11 - 15 years of experience
2 months ago
Job Overview by Ladders

Qualifications

  • Ph.D. or equivalent in Electrical Engineering, Integrated Circuits, or Optical/Network Architecture.
  • 15+ years of experience in high-performance system architecture including ASICs, optics, PCB, and thermal management.
  • Proven track record in defining and executing multi-terabit platforms.

Responsibilities

  • Define and implement a strategy for silicon ASICs and co-packaged optics platforms in data centers.
  • Establish a cross-domain system architecture that satisfies AI network requirements across various metrics.
  • Lead the development of integrated systems encompassing hardware, optics, thermal management, and packaging.
  • Collaborate with hyperscaler and service provider customers to tailor product features for deployment.
  • Drive innovation in co-packaged optics and foster relationships within standards organizations.
  • Promote the benefits of AI networking to enterprise-level clients and service providers.
  • Publish research and represent the company in industry standards bodies while building academic partnerships.
  • Mentor and collaborate with teams across R&D, PLM, Marketing, Services, and Sales for overall success.
Full Job Description
Job Description

Join the Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we've united two industry leaders to create an optical networking powerhouse-combining cutting-edge technology with proven leadership to redefine the future of connectivity.

Responsibilities

  • Define and deliver a strategy for silicon ASICs (multi-terabit) and the architecture of co-packaged optics platforms across inter / intra Data Center.
  • Define cross-domain system architecture (ASIC, optics, PCB, backplane, cooling) to meet AI network requirements in performance, cost, power, space, efficiency, telemetry, and modularity
  • Lead definition of integrated system development: hardware, optics, thermal, cooling, and packaging
  • Collaborate with hyperscaler and service provider customers to align product features with real-world deployment needs
  • Lead innovation in co-packaged optics, open standards, and partner ecosystems (Inphi, OIF, IEEE)
  • Evangelize AI networking advantages/impacts to enterprise, hyperscalers, and service providers
  • Gain industry mindshare, publish in leading conferences, represent the company in standards bodies, and foster R&D and academic partnerships
  • Partner / Mentor team as well as cross organizations in R&D, PLM, Marketing, Services, and Sales, ensuring company success


Qualifications

  • Ph.D. or equivalent in EE, IC, Optical/Network Architecture
  • 15+ years in high-performance system architecture: ASICs, optics, PCB, thermal management
  • Experience in defining and executing on multi-terabit platforms

About Nokia

Nokia is a Finnish multinational telecommunications, information technology, and consumer electronics company. The company was founded in 1865 and has since grown to become one of the largest telecommunications equipment manufacturers in the world. Nokia's products include mobile phones, smartphones, and network equipment, among others. The company is committed to innovation and has a strong focus on research and development. Nokia is also committed to sustainability and has set ambitious targets for reducing its environmental impact. The company operates in over 100 countries and has a strong presence in Europe, Asia, and North America.
Learn more about Nokia
Size
87,927 employees
Market Cap
$25.8 billion
Industry
Telecommunications & Hardware
Net Income
-$2.5 billion
Founded
1865
5 Year Trend
-1.2%
Revenue
$21.8 billion
NASDAQ
NOK
* Ladders Estimates

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