MacBook Air design requires thousands of engineering decisions that balance performance, battery life, thermals, reliability, manufacturability, and industrial design. We're looking for talented System EEs who enjoy solving complex system-level tradeoffs and turning ambitious product concepts into products used by millions of people worldwide.
In this role, you will own key aspects of the electrical and system design integration, defining, designing and validating the electrical subsystems that differentiate MacBook Air. You'll collaborate closely with experts across mechanical engineering, Apple Silicon, software and module technology teams to deliver industry-leading products.
You'll apply your expertise in computer system architecture, circuit design, power delivery, high-speed interfaces and PCB design to solve some of the industry's most challenging system integration problems-all while maximizing performance, battery life, reliability, and user experience within one of the world's most space-constrained consumer products. If you thrive in a fast-paced, collaborative environment and are excited by solving complex engineering challenges at massive scale, we'd love to hear from you.
Description
Day-to-day responsibilities include partnering with system architects to translate product requirements into robust electrical subsystem designs. You will define, design, simulate, test and validate these designs, develop schematics and implement highly constrained multilayer PCBs, and work closely with PCB designers to deliver robust implementations supported by simulation and engineering analysis. As the Design Responsible Individual (DRI) for your subsystem, you will present design proposals and tradeoffs to cross-functional partners and engineering leadership, drive technical discussions, and build alignment through design reviews.
Throughout product development, you will drive technical decisions by leading system bring-up, debugging complex hardware issues, and driving system validation in collaboration with cross-functional engineering teams. You will own your subsystem through mass production, partnering with manufacturing and operations to support factory builds, resolve line-down issues, root-cause manufacturing and yield excursions, and implement robust design improvements that enhance product quality, manufacturability, and production efficiency. We are looking for engineers with strong technical fundamentals, broad system knowledge, sound engineering judgment, and the curiosity to dive deep and solve difficult problems wherever they arise.
There will be opportunities for international travel.
Minimum Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or equivalent.
3+ years of industry experience designing consumer electronics and/or embedded systems, with a proven track record of collaborating across cross-functional teams.
Strong electrical engineering fundamentals, including analog and digital circuit design, signal integrity, and power integrity.
Experience in circuit design across a broad range of domains, including power, digital, analog, high-speed interfaces, programmable logic, and/or wireless systems.
Strong PCB layout expertise spanning constrained multilayer designs, HDI technologies, fine-pitch BGAs, high-speed interfaces, power delivery networks, flex circuits, and cable assemblies. Proficiency with Allegro or equivalent PCB design tools.
Experience with electrical validation and debug using high-speed oscilloscopes, vector network analyzers, BERTs, and protocol analyzers.
Preferred Qualifications
Hands-on experience with rapid prototyping, new technology bring-up, and first-to-market product development.
Demonstrated ability to understand and debug complex technical problems across multiple levels of abstraction, from system architecture down to silicon and transistor-level behavior.
Solid understanding of the design, validation, and debug requirements for common interfaces (e.g., I2C, SPI, JTAG, I2S) and high-speed interfaces (e.g., USB, PCIe, DisplayPort, Thunderbolt, DDR).
Experience with schematic capture and constraint-driven PCB design using Cadence Allegro/OrCAD or equivalent EDA tools.
Experience with numerical modeling, simulation, and analysis tools, including SPICE, 2D/3D field solvers, and power and signal integrity analysis.
Experience with data analysis, visualization, and scripting to automate validation, debug, and engineering workflows.
Excellent written and verbal communication, presentation, and cross-functional collaboration skills.
Curious, creative, collaborative, and driven to solve challenging engineering problems while continuously learning and improving.
