Position: Hardware Engineer - Interconnect systemsLocation: Nashua, NHAmphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. Our global headquarters are located in Nashua, NH and we have design, sales and manufacturing locations globally.
Position SummaryWe are seeking an experienced Hardware Engineer to join our High-Speed Interconnect R&D team. The successful candidate will be responsible for the design, development, and validation of hardware platforms supporting Ethernet and PCIe interconnect products, including Active Electrical Cables (AEC), Optical Transceivers, and Linear Pluggable Optics (LPO).
The ideal candidate will have strong experience in high-speed digital hardware design, schematic capture, PCB development, component selection, power architecture, and board bring-up, working closely with cross-functional engineering teams from concept through production.
ResponsibilitiesHardware Design & Development
- Design and develop hardware platforms for Ethernet and PCIe interconnect products such as AEC, optical transceiver, and LPO products.
- Develop schematics, component selection, and hardware design documentation.
- Define PCB stack-ups, layer assignments, and component placement requirements.
- Work closely with PCB layout engineers to optimize routing, manufacturability, and performance.
- Support design reviews and product qualification activities.
DSP and Retimer Integration- Integrate DSPs, retimers, and SerDes devices into high-speed interconnect product test platforms.
- Collaborate with SI engineers to optimize channel performance and equalization.
- Support device bring-up, configuration, characterization, and validation.
- Develop and review high-speed channel architectures for copper and optical products.
- Support CMIS-compliant management architectures and low-speed control interfaces.
- Collaborate with optical, firmware, SI, and mechanical engineering teams.
Power Architecture- Define power architectures including PMICs, DC-DC converters, LDOs, sequencing, and monitoring circuits.
- Support power integrity and analysis activities.
- Collaborate with thermal and mechanical teams to optimize cooling solutions, including direct module cooling and cold-plate architectures.
- Evaluate power consumption and thermal performance for high-density networking products.
Experience in below products is a plus- Experience with OSFP, QSFP-DD, OSFP-XD, or LPO modules.
- Experience with Broadcom, Marvell, or similar high-speed networking chipsets.
- Experience supporting customer-facing technical discussions and design reviews.
Required Qualifications- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
- 5+ years of experience in hardware design and development of high-speed networking or communication products.
- Strong understanding of signal integrity, power integrity, and high-speed design principles.
- Experience with optical networking products, AI infrastructure, cloud networking, or hyperscale data center platforms.
- Working knowledge of Ethernet standards, PCIe specifications, and high-speed networking architectures.
