The Seattle Silicon Lab is responsible for performing high-end security evaluations and research for our clients focusing on embedded devices. This includes systems which utilize SoCs/ICs using technology nodes between 180nm and 22nm. These chips may be used in automobiles, payment devices, mobile phones, satcom, entertainment consoles and medical devices. We are seeking a Failure Analysis Engineer who will work with other team members to deliver the highest quality results to IOActive's clients throughout the world.

Who you are:

Our experts operate at the very highest level of expertise regarding Integrated Circuit (IC) deprocessing techniques and high-resolution imaging. This requires expert knowledge and experience in areas such chemical/physical material preparation techniques and electron/ion beam imaging.

What you'll do:

• The Failure Analysis Engineer will undertake advanced level imaging and security evaluation tasks and duties to meet customer requirements and project deadlines
• Investigate packaged silicon devices down to transistor level
• Document observations on physical security countermeasures encountered during deprocessing
• Develop and optimize sophisticated, state-of-the-art deprocessing and imaging techniques
• Research evolving deprocessing and imaging techniques, source instrumentation and integrate into an optimized lab workflow
• Support software development efforts in creating tools to assist in reaching project goal
• Communicate complex vulnerabilities to both technical and non-technical client staff
• Assist research on new attack vectors, discover new vulnerabilities, create new exploitation techniques
• Learn, develop and optimize invasive attack techniques for use in data extraction
• Support business development efforts through the scoping of engagements

What you bring:

• Strong technical skills with in-depth fault analysis experience across a wide range of semiconductor and package technology
• Professional communication skills including advanced report and presentation preparation, review and delivery in a collaborative environment
• Safety focused mindset to ensure work is completed safely and efficiently
• Experience coordinating and performing physical delayering and image acquisition utilizing SEM/FIB technology
• Expertise in advanced EFA principles and tooling such as Emission-based analytical tools, Laser Scanning Microscopy, and imaging tools (3D Xray, CSAM, etc.)
• Demonstrated background in fault localization (ATE, application board, PEM, DLS, OBIRC, thermal, scan, memory)
• Experience conducting physical analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects.
• Experience with CAD design tools and / or Reverse Engineering Software

What We Offer

A chance to work with an industry leader in cyber security

Access to world-class technical teams and research

A high-energy, collaborative team that values innovation

This is a full time in lab role working with some of the brightest minds in cyber security

Opportunities for travel

Competitive compensation and performance-based incentives, total comp range $100,000 - $150,000 depending on experience

If this sounds like your kind of challenge, we'd love to hear from you. Let's talk!