Failure Analysis Engineer

Applied Optoelectronics, Inc.

$90K — $120K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 1-3+ years hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment.
  • Master's degree or Ph.D. in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of experience in semiconductor lab or fabrication is preferred.
  • Desirable knowledge of compound semiconductor device theory.
  • Preferred programming skills in Microsoft Access, SQL, LabVIEW.
  • Experience with DOE techniques and Statistical Process Control (SPC) is preferred.
  • Strong data analysis and problem-solving capabilities are essential.
  • Ability to work independently and collaboratively in a team setting.

Responsibilities

  • Conduct internal failure analysis including decap, microscopic inspection, and measurement data analysis.
  • Utilize Focused Ion Beam (FIB) for sample preparation and perform high-resolution imaging to detect atomic-level defects.
  • Perform root cause analysis on structural, electrical, and physical defects affecting semiconductor yield and reliability.
  • Characterize materials using EDX/EDS and other analytical techniques like SIMS, XPS, and SEM.
  • Document findings in detailed reports and present data to cross-functional teams to support continuous improvement efforts.
  • Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Benefits

  • Flexible and competitive health insurance plans to meet diverse needs.
  • Employer matching on 401(k) contributions to support retirement savings.
  • Generous PTO policy with payout for unused days at year-end.
  • Relocation assistance available for candidates moving within the US.
  • Immigration sponsorships offered for qualified applicants.
Full Job Description
Summary

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

  1. Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.
  2. Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.
  3. Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.
  4. Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.
  5. Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.
  6. Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.


Qualifications

  1. Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1-3+ years).
  2. Master's degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.
  3. Knowledge of compound semiconductor device theory is desired.
  4. Microsoft Access, SQL, LabVIEW and other programing skills preferred.
  5. Experience with DOE techniques and SPC (Statistical Process Control) is preferred.
  6. Strong data analysis and problem solving skills.
  7. Detail oriented and self-motivated.
  8. Ability to work independently and as a team.
  9. Ability to work in clean room environment wearing smock
  10. Excellent interpersonal and communication skills for successful inter and intra-group interactions.


Physical Demands and Work Environment

  1. Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.
  2. The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

In addition to competitive salary, AOI offers
  • Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs
  • Employer matching on 401(k) deferrals
  • Generous PTO policy, with unused PTO payout at end of the year
  • Relocation package available within US
  • Immigration sponsorships (Must be currently authorized to work in the US)


We do not accept unsolicited proposals from third-party recruiters or agencies. Contacting hiring managers directly may result in disqualification of submissions.

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