Responsibilities: • Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Singulation, Photolithography, Solder Bumping, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). • Work with process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions and eliminate chronic and long-term down events. • Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk. • Complete new tool start-up and tool upgrades to increase fab capability, capacity, lower costs and improve yields. • Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations. • Participate in cross-functional teams that create efficiencies across all layers of the organization. • The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications Education: Bachelor of Science or in Mechanical, Electrical or Chemical Engineering, Materials Science, Physics or other relevant Engineering discipline. Experience and/or Training: • 2-5 years of related experience • Experience with High Vacuum and Toxic Gas Delivery systems. • Experience with application of structured problem-solving methodology. • Positive interpersonal skills, highly energetic and self-motivated. • Outstanding written and verbal communication skills. • Demonstrated ability to meet requirements and deliver results. • Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs. US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship. Preferred Qualifications: • Experience with wafer/die bonding equipment and/or processes • Experience with Automated Fault Detection and Classification Systems (FDC). • Background with utilizing SPC. • Understanding of equipment component behavior. • Experience Integrating Equipment Maintenance Management Software The annual salary range for this role is $79,440 - $119,160. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits, including 401k match, and life insurance. Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.