Job Description- Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time.
- This is an 1st shift Monday-Thursday (10 hours per day) Position 4/10 work week every Friday off.
The team member (you) will provide manufacturing engineering local leadership to within our microwave wire bonding manufacturing cell under the guidance and with the support of more senior engineers . This process engineering team member will coordinate with the various functions to help support front line issues while driving continuous improvement activity for further cost reduction in the factory. This is an early career position with experienced process engineers providing appropriate mentorship to help establish confidence, leadership and ownership in the individual to help support a long term career growth.
The team member will support our bonding cell and responsibilities include: direct support and training of new operators, assisting in the development, sustainment, and improvement of the processes via both automated and manual machinery throughout the wire and ribbon bonding work cells. Additional duties may include, but are not limited to, nonconforming material review, FAI support, and design of custom fixtures for supporting factory-wide initiatives as well as day to day execution of production goals.
This process engineering job will effectively support a group of 10-15 cross-functional employees and will be empowered to help with various decisions that improve the overall success of the microelectronics factory (yield improvements, cost take out, delivery improvements).
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Required Skills and Education- At least 1 year experience in a microelectronic or aerospace process engineering position
- At least 2 years of experience in microelectronic assembly
- Ability to complete assigned tasks with minimal supervision and demonstrate leadership necessary to support the manufacturing team
- Ability to present and clearly communicate data to peers, management, and customers.
- Ability to prioritize tasks to meet deadlines
- Ability to work independently and in a team
- Ability to understand, analyze, and resolve complex technical problems.
- Familiarity with Windows based applications (Word/Office/Excel in addition to general comfort using computers and interacting with software and computer controlled equipment)
Preferred Skills and EducationBachelor's Degree in an Engineering discipline or in a related Technical degree
- Experience with a Palomar 8000 or 8100 wirebonder
- Lean knowledge (single piece vs batch processing) preferred
- Six Sigma training or projects preferred
- Knowledge of the hybrid multichip module design
- Experience with engineering drawings
- Experience with Gage R+R
- Experience with precision mechanical assembly equipment
- Experience with automated high power microscopes and automated optical inspection
- Secret Clearance
