Electrical Engineer (UMI)

Physical Intelligence

$110K — $150K *
Technical Services
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 3-7 years of experience in hardware design for high-volume products.
  • BS/MS in Electrical Engineering or related field.
  • Proficiency in EDA tools like Altium or Allegro for multi-layer designs.
  • Hands-on experience with CMOS image sensors and MIPI interfaces.
  • Strong understanding of signal integrity and EMI/EMC for high-speed circuits.
  • Experience in efficient power delivery network design for mobile devices.
  • Familiarity with various communication protocols like CAN, I2C, and wireless protocols.

Responsibilities

  • Lead the electrical design of data collection devices, including component selection and PCBA.
  • Integrate high-resolution image sensors, ensuring optimal power and data pathways.
  • Design and optimize RF front-ends for wireless modules with attention to signal range.
  • Oversee schematics and execute PCB layouts for complex enclosures.
  • Create test plans for hardware validation, identifying bugs and thermal issues.
  • Collaborate with manufacturing for high-yield design and assembly optimization.
  • Optimize hardware-level power consumption and assist in thermal testing.

Benefits

  • Work in a collaborative environment involving multiple engineering teams.
  • Gain exposure to the latest technologies in hardware and imaging systems.
  • Opportunity to impact product design and functionality directly.
  • Engagement with cutting-edge wireless and image sensor technologies.
Full Job Description
The team

This role is part of the hardware team, but will involve deep collaboration with the embedded firmware team and the robot software engineering (runtime) team.

In this role you will:

- Drive Hardware Architecture: Lead the electrical design of devices crucial to PI's data collection, from component selection (SoCs, Sensors, PMICs) to final PCBA.

- Imaging System Design: Lead the hardware integration of high-resolution image sensors, ensuring clean power rails and high-speed data paths (MIPI) for optimal image quality.

- Wireless Hardware Integration: Design and optimize RF front-ends for wireless modules, focusing on antenna placement, signal range, and power consumption.

- Schematic & Layout: Take full ownership of schematics and supervise/execute PCB layouts for complex, space-constrained enclosures.

- Hardware Validation: Design and execute test plans to identify hardware bugs, signal integrity issues, and thermal bottlenecks.

- DFM/DFT: Work with manufacturing partners to ensure designs are optimized for high-yield assembly (Design for Manufacturing) and comprehensive on-line testing (Design for Test).

- Power Optimization: Analyze and optimize the hardware-level power consumption for battery-operated devices, and assist with thermal testing and validation of the devices.

What we hope you'll bring:

Competencies and Skills

In addition to 3-7 years of experience in hardware design and board-level development for high-volume products, strong candidates must have:

- BS/MS in Electrical Engineering or a related technical field.

- PCB Design Expertise: Proficiency in EDA tools (e.g., Altium, Allegro) for complex, multi-layer, high-density interconnect designs, and experience with rigid flex circuits

- Camera System Experience: Hands-on experience with CMOS image sensors, MIPI CSI-2/3 interfaces, and the electrical requirements for high-bandwidth imaging data, including bring-up and image tuning

- High-Speed Design: Deep understanding of signal integrity, power integrity, and EMI/EMC mitigation for high-speed digital and RF circuits.

- Bring-up & Validation: Experience with lab equipment (oscilloscopes, spectrum analyzers, logic analyzers) to lead initial board bring-up, debugging, and hardware validation.

- Power Management: Experience designing efficient power delivery networks (PDN), including DC-DC converters, LDOs, and battery management systems (BMS) for mobile devices.

- Communication Protocols: Familiarity with CAN, Ethernet, SPI, I2C, UART, USB (2.0/3.0/Type-C), and PCIe, as well as wireless protocols including BLE and Wi-Fi (2.4GHz/5GHz), and the ability to evaluate and debug these systems.

- Cross-functional Collaboration: Ability to translate ambiguous product goals into hard functional requirements for firmware, mechanical, and research teams.

Bonus Points:

- Experience with RF/Antenna integration and FCC/CE certification processes

- History of working with JDMs and ODMs

- Knowledge of flex-circuit (FPC) design and rigid-flex integration

- Experience with robotic actuators or motor control circuitry

- Understanding of thermal design optimization and testing

Pursuant to the San Francisco Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

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