Job DescriptionThis is a senior execution leadership role for a technically credible program leader who can improve schedule predictability, strengthen cross-functional accountability, and drive disciplined execution from concept through architecture, design, verification, tape-out, validation, qualification, production ramp, and post-launch support.
Position SummaryThe Director, PMO will lead the ISG program management function across Automotive Sensing Devices (ASD) and Industrial and Commercial Sensing Devices (ICSD). This leader will be responsible for program governance, execution cadence, schedule discipline, customer milestone management, risk management, escalation, and cross-functional alignment for major new product development, customer, technology, and product transfer programs.
The successful candidate must be able to operate as an active program leader who understands semiconductor product development, can challenge assumptions constructively, can connect technical tradeoffs to business impact, and can drive teams to committed outcomes. The leader will partner closely with chip leads, engineering, product definition, product marketing, applications, operations, quality, supply chain, finance, sales, and customers.
ResponsibilitiesKey Responsibilities- Lead and develop the ISG PMO organization, including program managers supporting ASD, ICSD, customer programs, technology initiatives, product transfers, and cross-functional execution priorities.
- Establish a consistent ISG program operating model, including governance, decision forums, execution cadence, milestone reviews, escalation paths, risk reviews, and accountability mechanisms.
- Drive integrated program planning for complex semiconductor products, including scope, requirements, resources, dependencies, risk registers, milestone commitments, customer deliverables, and manufacturing ramp readiness.
- Manage program schedules for critical development milestones, including requirements closure, architecture, design, verification, tape-out, silicon bring-up, validation, qualification, production release, customer commitments, and revenue timing.
- Partner with chip leads and functional leaders to integrate technical ownership with program management ownership, ensuring clear decision rights, action tracking, escalation, and accountability for technical and business outcomes.
- Identify, escalate, and help resolve cross-domain execution issues across architecture, pixel and technology development, analog, digital, RTL, verification, DFT, physical design, firmware/software, image quality, validation, test, package, product engineering, operations, quality, and manufacturing.
- Drive alignment across product definition, product marketing, applications, engineering, operations, quality, finance, supply chain, sales, and customers to ensure product scope, customer requirements, cost, schedule, quality, and business objectives are understood and met.
- Lead customer program management for strategic engagements, including customer milestone interlocks, deliverable commitments, technical status communication, risk management, and escalation resolution.
- Establish execution metrics and dashboards for schedule health, milestone attainment, technical risk, resource constraints, customer commitments, design-win dependencies, quality readiness, and production ramp status.
- Improve execution discipline across ISG by identifying process gaps, simplifying workflows, reducing non-value-added overhead, and implementing practical best practices for image sensor and mixed-signal IC development.
- Drive proactive risk management and issue resolution, ensuring blockers are surfaced early, ownership is clear, alternatives are evaluated, and decisions are made at the right level.
- Support portfolio-level prioritization by providing objective program health, schedule entitlement, resource utilization, cost, customer commitment, and execution risk inputs to ISG leadership.
- Ensure new product development gate reviews, executive reviews, change control, dependency management, and lessons-learned closure are disciplined, factual, and action-oriented.
- Mentor and coach program managers to become technically fluent execution leaders who can challenge teams constructively, communicate clearly, and drive accountability in a matrixed organization.
- Champion continuous improvement, including practical use of productivity tools, process automation, AI-enabled workflows, reusable program management practices, and simpler execution systems.
QualificationsRequired Qualifications- Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
- 15+ years of experience in the semiconductor industry, including significant experience in program management, product development, engineering leadership, product engineering, test engineering, design engineering, or related technical execution roles.
- Hands-on experience managing or leading complex ASIC, mixed-signal IC, CMOS image sensor, sensor interface, or semiconductor product development programs from concept through launch and production support.
- Strong understanding of semiconductor new product development flows, including requirements definition, architecture, design, verification, tape-out, silicon bring-up, validation, test, qualification, packaging, product engineering, manufacturing ramp, and production release.
- Proven ability to lead cross-functional teams in a matrixed environment, influence without direct authority, resolve execution conflicts, and drive accountability across global teams.
- Strong technical and analytical problem-solving skills, with the ability to understand root cause, evaluate tradeoffs, assess schedule and quality impact, and drive corrective actions.
- Ability to communicate program status, risks, decisions, and tradeoffs clearly to engineering teams, business leaders, executives, customers, and cross-functional stakeholders.
- Strong business acumen with the ability to connect program execution to revenue timing, roadmap delivery, customer commitments, cost, quality, margin, and resource utilization.
Preferred Qualifications- Advanced technical degree, MBA, or program management certification preferred.
- Experience with image sensing, CMOS image sensors, mixed-signal ASICs, sensor interfaces, automotive and industrial product requirements, customer milestone management, and quality expectations.
- Demonstrated success building or improving PMO capability, including governance, metrics, talent development, execution cadence, and schedule predictability.
- Experience managing programs through tape-out, silicon bring-up, validation, qualification, production release, customer deliverables, and post-production support.
- Ability to operate at both detailed technical execution level and executive business review level.
- Track record of improving execution systems, simplifying processes, reducing overhead, and creating a culture of ownership, transparency, and predictable delivery.
- Self-driven, responsive, and comfortable operating in high-accountability environments with multiple stakeholders, complex dependencies, and customer-visible commitments.
TravelTravel is expected to be approximately 10%. Occasional domestic and international travel to customer sites, development locations, and
onsemi offices may be required.
onsemi is excited to share the base salary range for this position is $178,135.00 to $320,505.00 Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
