Job/Position Summary

The Process Integration & Technology Transfer Director will own the end-to-end manufacturing process flow for the company's advanced substrate fab in India. This role is responsible for translating product and technology requirements into a manufacturable, qualified, and scalable process-of-record.

The role bridges technology development, equipment selection, facilities readiness, process module engineering, quality, reliability, and production ramp. The ideal candidate should have strong hands-on experience in advanced substrates, semiconductor packaging, PCB/substrate manufacturing, glass substrates, ABF buildup, Digital & RF modules, or panel-level processing.

Primary Responsibilities

1. End-to-End Process Flow Ownership
• Own the full substrate manufacturing process flow from incoming core to finished substrate.
• Define the process-of-record for glass and/or organic-core substrate manufacturing.
• Integrate process modules, including cleaning, via formation, metallization, seed/barrier, plating, dielectric buildup, lithography, etch, strip, surface finish, inspection, reliability, and electrical test.
• Ensure all process steps are compatible with panel size, material stack, line/space targets, via density, warpage limits, and customer reliability requirements.
• Identify process gaps, yield risks, and integration conflicts before tool installation.
2. Technology Transfer & Ramp Readiness
• Lead transfer of technology from the U.S., partner, or development team into India manufacturing.
• Convert R&D recipes and engineering assumptions into production-capable process flows.
• Define process windows, control parameters, qualification plans, and ramp milestones.
• Work with equipment engineering to ensure tools are capable of meeting process requirements.
• Work with manufacturing to develop SOPs, operator instructions, training plans, and production controls.
3. Process Module Integration
• Own integration across incoming glass or organic core inspection, surface preparation, cleaning, TGV/via processing, PVD/electroless/seed metallization, copper plating and via fill.
• Integrate dielectric coating, lamination or buildup, laser drilling/ablation, lithography/exposure, develop/etch/strip, solder mask or final dielectric, and ENEPIG/surface finish.
• Coordinate warpage control, routing/singulation, AOI/metrology, electrical test, and reliability testing into the final manufacturing flow.
4. Design Rule & Product Integration
• Work with design, customers, and product engineering to define manufacturable design rules.
• Translate customer requirements into process capability requirements.
• Support design-for-manufacturing reviews for RF IPD, glass substrates, interposers, organic substrates, and advanced packaging substrates.
• Define limits for line/space, via diameter, via pitch, dielectric thickness, copper thickness, registration, warpage, surface finish, and panel-level tolerances.
• Support reference coupon design for process monitoring, reliability, and customer qualification.
5. Yield, Defectivity & Failure Analysis
• Own process-related yield improvement during development, qualification, and ramp.
• Lead root-cause analysis for defects such as opens, shorts, delamination, voids, dendrite growth, seed residue, plating defects, dielectric defects, warpage, adhesion failures, and via resistance variation.
• Work with quality and reliability teams to define failure-analysis workflows and corrective actions.
• Use SPC, DOE, FMEA, control plans, and defect Pareto analysis to improve yield.
• Establish process monitors and inline control structures.
6. Equipment & Facilities Interface
• Partner with equipment engineering on tool capability, tool selection, FAT/SAT criteria, and qualification requirements.
• Review tool specifications from a process capability standpoint.
• Provide process input to facilities on utilities, chemicals, exhaust, cleanroom class, vibration, humidity, UPW, waste segregation, and temperature control.
• Ensure facility and utility design supports process stability and contamination control.
• Participate in tool install, commissioning, and process qualification.
7. Quality, Reliability & Customer Qualification
• Define the process qualification plan for new products and new process flows.
• Work with quality to establish control plans, reliability test plans, acceptance criteria, and customer documentation.
• Support qualification for humidity testing, thermal cycling, solder reflow, adhesion, ionic contamination, electrical continuity, via resistance, and surface finish reliability.
• Support ISO 9001, IATF 16949, AS9100, or customer-specific quality systems as needed.
• Lead technical customer discussions related to process capability and qualification status.
8. Team Building & Leadership
• Build and lead the India process integration and module engineering team.
• Hire process engineers for plating, lithography, dielectric buildup, wet process, metrology, test, and reliability interface.
• Mentor engineers on structured problem-solving, DOE, SPC, failure analysis, and process control.
• Establish a disciplined engineering review process for process changes and yield excursions.
• Coordinate with U.S. or global technical teams to maintain technology alignment.

Requirements
• Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Microelectronics, Semiconductor Processing, or related field.
• 12-20+ years of experience in semiconductor packaging, substrate manufacturing, PCB, display, semiconductor fab, MEMS, RF module, or high-tech manufacturing.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.