Doctorate/Masters/Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
Strong understanding of power packaging methods, assembly processes, qualification methods, SPC, and statistical analysis software.
Knowledge of wire-bonding & multi-chip module technologies is a plus.
Strong interpersonal, analytical and presentation skills.
Responsibilities
Lead technology development for package and product qualification in AI/Datacenter Power packaging.
Design and develop advanced package and interconnect methods for Smart Power Stages and related power modules.
Select and qualify materials, processes, and assembly subcontractors for package development.
Conduct Design of Experiments (DOE) with OSAT/CM to optimize processes and establish specifications.
Collaborate with product and reliability teams to qualify new packages within deadlines.
Resolve integration issues by overseeing critical process checks and maintaining production quality.
Monitor and address process issues during production to ensure high-quality output.
Benefits
Competitive benefits package provided during the hiring process.
Full Job Description
Job Description
Responsibilities:
Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
Focus on design and development of package and interconnect methods for Renesas's AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
Resolve all process integration issues by ensuring all window checks are done on critical process steps.
Establish production controls and monitors to ensure there is no room for quality incidents.
Ensure smooth transition into production & implement ramp up monitor.
Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
Participate in packaging roadmap development & focus on execution.
Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
Establish & maintain package design rules.
Qualifications
Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
Knowledge of wire-bonding & multi-chip module technologies a plus.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.
Additional Information
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
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About Renesas Electronics America
Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
