Diodes

Director of Packaging Technology

Diodes • $140K — $180K *
Dallas, TX 75217In-Person
Consumer Technology
11 - 15 years of experience
Today
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Job Overview by Ladders

Qualifications

  • MSc or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
  • 15+ years direct experience in semiconductor packaging or advanced electronics packaging.
  • 10+ years in global team management and leadership roles.
  • Strong knowledge of packaging technologies, materials, and assembly processes.
  • Experience with package reliability testing and qualification standards.
  • Deep understanding of thermal, mechanical, and electrical interactions in package design.
  • Fluent in English; Mandarin proficiency is a plus.

Responsibilities

  • Lead the design, development, and qualification of semiconductor packaging solutions.
  • Define package architecture based on various requirements including electrical and thermal.
  • Drive package technology development for new product introductions.
  • Collaborate with cross-functional teams to ensure compatibility and performance of packages.
  • Oversee layout reviews, stack-up definition, and material selection in packaging.
  • Guide simulations and analyses related to thermal, mechanical, and electrical requirements.
  • Develop assembly processes and quality requirements for manufacturing partners.

Benefits

  • Onsite work location in Dallas, TX.
  • Opportunity to lead global teams in a cutting-edge technology sector.
Full Job Description
About the Role

Director Of Packing Technology
  • Location: Dallas TX (USA) onsite

We are seeking a Director/Sr. Director of Packaging Technology to lead global teams in the development and integration of packaging solutions for high-performance semiconductor products. This role will focus on package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing analog and power products from concept through qualification and high-volume production.

What You'll Do

  • Lead the design, development, and qualification of semiconductor packaging solutions, including:
    • Flip-chip, Chip Embedding, Wafer-level packaging (WLP/FOWLP)
    • Panel-level packaging
    • System-in-package (SiP), multi-chip modules (MCM) and power modules
    • Leaded packages for power applications
  • Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
  • Drive package technology selection and development for new product introductions.
  • Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.
  • Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
  • Perform and guide simulations and analysis related to thermal, mechanical, electrical, as well as design for manufacturability (DFM).
  • Develop assembly flows and process requirements for captive plants and OSATs/manufacturing partners.
  • Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
  • Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.
  • Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
  • Create and maintain package specifications, design rules, process documentation, and technical reports.
  • Partner closely with corporate leadership to define multi-year capability/capacity roadmaps aligned with product and business growth, resource plans, and organizational strategy.


Who You Are

  • MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
  • 15+ years of direct experience in semiconductor packaging or advanced electronics packaging.
  • 10+ years of global team management and leadership roles.
  • Strong knowledge of packaging technologies, materials, and assembly processes.
  • Experience with package reliability testing and qualification standards.
  • Deep understanding of thermal, mechanical, and electrical interactions in package design and CPI (chip-package interaction).
  • Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
  • Ability to troubleshoot packaging failures and drive root cause/corrective action.
  • Strong project and global team leadership and cross-functional communication skills.


Core Competencies
  • Required: Fluent in English (written and spoken)
  • Mandarin a plus, but not required

About Diodes

Diodes Incorporated is an American manufacturer and supplier of discrete, logic, analog and mixed-signal semiconductors. Its headquarters is located in Plano, Texas, United States. The company's products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. The company's target markets include automotive, communications, computing, consumer electronics, and industrial.
Learn more about Diodes
Size
8,921 employees
Market Cap
$3.4 billion
Industry
Manufacturing & Automotive
Net Income
$98 million
Founded
1959
5 Year Trend
+13.9%
Revenue
$1.2 billion
NASDAQ
DIOD
* Ladders Estimates

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