Renesas is seeking a
Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.
Responsibilities: 1. Technology Roadmap & R&D Strategy- Define and execute the global packaging roadmap, focusing on Power SiP/Modules, Wafer Level Packaging, and Flip-Chip technologies.
- Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing).
- Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand.
- Establish and maintain corporate package design rules to ensure manufacturability and reliability
2. Global OSAT & Supply Chain Management- Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies.
- Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications.
- Monitor production early in the ramp phase to resolve integration issues and ensure superior quality.
3. NPI, Qualification & Quality Control- Lead the transition of new products from R&D to High Volume Manufacturing (HVM).
- Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes.
- Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps.
- Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions.
4. Cross-Functional Leadership- Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions.
- Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).
Qualifications- Education: Doctorate, Master's, or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
- Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules and wafer level & flip-chip packaging.
- Deep knowledge of Power SiP/Modules, Flip-Chip, and Wafer Level assembly.
- Familiarity with Smart Power Stages and Vertical Power architectures.
- Expertise in SPC, statistical analysis software, and qualification methods.
- Exceptional interpersonal, presentation, analytical and communication skills
Additional InformationThe expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.
Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.
Videos To Watchhttps://www.youtube.com/watch?v=k-zs4tB6nNc
