Shift:The regular hours for this position are day shift.
Job Description:The
Director, Advanced Product Engineering will drive the development and delivery of advanced cooling solutions for probe card technologies. This role is responsible for defining technical vision and roadmap for thermal solutions, leading multiple engineering efforts, and ensuring alignment with product, manufacturing, and business objectives.
The individual will lead and scale a high-performing engineering team, develop critical capabilities, and drive innovation in cooling architectures for next generation semiconductor test systems. Success in this role requires a balance of deep domain expertise, organizational leadership, and the ability to influence across functions and levels.
Key Responsibilities: - Lead the architecture, design, and development of cooling solutions for probe card technologies.
- Define and own thermal technology strategy and multi-year roadmap aligned to business objectives.
- Lead, develop, and scale a team of engineers.
- Drive resource planning, prioritization, and organizational design to support product and technology goals.
- Establish and track business and engineering Key Performance Indicators (KPIs) and manage development programs using Product Life Cycle (PLC) methodology.
- Develop and evaluate new concepts for heat removal, temperature uniformity, and thermal stability.
- Ensure organization has the technical rigor to execute development and implementation of solutions for highly complex product and engineering challenges.
- Technically lead and/or execute engineering projects and spearhead research and development of new technologies, as appropriate.
- Lead escalation resolution for critical product and customer issues. Interface with internal and external stakeholders to resolve complex engineering issues and meet customer commitments.
- Collaborate with manufacturing to build prototypes, alpha and beta probe cards.
- Drive continuous improvement across development process, manufacturability, and reliability. Own delivery of complex programs including schedule, cost, and technical performance outcomes.
Preferred Experience: - MS or Ph.D. in Mechanical Engineering, or a related engineering field preferred; BS with significant relevant experience will also be considered.
- 10+ years of relevant experience in thermal management, electronics cooling, semiconductor equipment, or related advanced product development environments.
- Demonstrated success leading engineering teams in semiconductor, electronics cooling, or related industries.
Skills: 3D Modeling, Agile Systems, AutoCAD 3D, Business Acumen, Communication, Computational Fluid Dynamics (CFD), Cross-Functional Collaboration, Cross-Functional Leadership, Engineering Leadership, Error Budgets, FEA Software, Geometric Dimensioning And Tolerancing (GD&T), Heat Transfers, Interpersonal Communication, Leadership, MATLAB, Problem Solving, Product Development, Python (Programming Language), Semiconductor Manufacturing, SolidWorks, Technology Strategy Development, Thermal Management, Thermomechanical Processing
Education & Experience: Minimum of 12+ years of relevant experience in leadership roles, with a Bachelor's degree; or 10 years and a Master's degree; or a PhD with 8 years experience; or equivalent experience | Required
Pay Range:$192,400.00 - $252,525.00
Pay Range Explained:This role in Livermore, California pays between $192,400.00 and $252,525.00 per year, depending on your experience, skills, and background. Pay may vary in other locations. We offer a full benefits package, including medical, dental, vision, life insurance, disability coverage, a 401(k) with company match, employee stock purchase plan (ESPP), and paid time off. You'll also be eligible for quarterly profit-sharing bonuses and flexible spending or savings accounts.
