Advanced Micro Devices, Inc

CPU Core Physical Design Thermal Modeling Lead

Advanced Micro Devices, Inc$150K — $180K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 5+ years in physical design engineering with a focus on thermal requirements and silicon performance.
  • Proven leadership in driving cross-functional alignment within technical teams.
  • Strong understanding of physical design methodologies for power and thermal optimization.
  • Experience with high-performance SoC/IP design and EDA tools.
  • Solid scripting skills for flow automation and process optimization.

Responsibilities

  • Lead the development of thermal modeling methodologies in collaboration with package teams.
  • Initiate design and analysis methodologies to enhance thermal profiles of products.
  • Convert product usage and package requirements into performance and thermal constraints.
  • Manage cross-functional thermal product requirements and critical project milestones.
  • Ensure timely resolution of issues and dependencies in project execution.

Benefits

  • Comprehensive health coverage including medical, dental, and vision plans.
  • 401(k) plan with company matching to help secure your financial future.
  • Flexible work arrangements including hybrid options to support work-life balance.
  • Employee discounts and perks, including wellness programs and fitness reimbursements.
  • Access to continuous learning and development opportunities within AMD.
Full Job Description
THE ROLE:

We are seeking a lead Physical Design Engineer to ensure that CPU Cores and SOC meet Thermal requirements and Silicon Performance. This is a technical role focusing on Physical design methodology requirements for power and thermals across IPs.

THE PERSON:

You will be a proven technical leader with the ability to drive cross-functional alignment and execution across architecture, physical design implementation, package modeling teams, ensuring timely closure and multi-dimensional alignment of power, thermal management and performance constraints. You will also be highly organized and execution-driven, with demonstrated success owning end-to-end technical workstreams and driving closure of open issues, risks, and dependencies across program milestones.

KEY RESPONSIBLITIES:
  • Drive development and alignment of thermal modeling methodology, collaborating with Package modeling teams across AMD products.
  • Drive new design and analysis methodologies to improve product thermal profile.
  • Translate product usage model, workload, and package requirements into IP performance, power, and thermal constraints and align with product performance-power models.
  • Drive thermal product requirements cross-function, managing critical deliverables at key project milestones.

PREFERRED EXPERIENCE:
  • Strong Physical Design background with extensive EDA tool experience.
  • Excellent knowledge of physical design power and performance metrics, and experience in high-performance SoC/IP design.
  • Familiarity with package models and advance packaging designs.
  • Familiarity collaborating with pre-silicon design and package modeling teams and aligning architecture assumptions/targets with projections.
  • Expertise in scripting and flow automation.

ACADEMIC CREDENTIALS:
  • Bachelors or Masters degree in computer engineering/Electrical Engineering


LOCATION:

Santa Clara, CA, or other AMD offices (Austin, Fort Collins, Boxborough)

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ

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