As a Camera and Depth Electrical Engineer in the RL Devices team, you will work on camera, depth, and sensor electrical design, with the flexibility to contribute across customized ASIC, camera, depth, and sensor electrical module designs, as well as system integrations. You will have the opportunity to work across multiple product lines, including Mixed Reality (MR), Wearables (Smart glasses and Display), AI devices, and Robotics. **What Impact You'll Make** You will push the boundaries of consumer electronics by miniaturizing advanced imaging technology into ultra-lightweight wearable devices, immersive Mixed Reality experiences, next-generation AI devices, and robotics platforms. Your work will help solve the engineering challenge of integrating camera, depth, and sensor systems seamlessly into these products-balancing optical performance, form factor, and user experience. From enabling robots to perceive and navigate their environments to powering the spatial awareness in MR headsets and AI-driven devices, you are shaping how next-generation technology understands and interacts with the world. **Who You'll Collaborate With** The Camera Depth Sensor (CDS) team owns camera, depth, and sensor development end-to-end, including sensor, ASIC, hardware designs (optical, mechanical, and electrical), architecture, characterization, process, and systems engineering. As an EE on the hardware design team, you will have direct collaboration with these teams within CDS, as well as cross-functional partners, including the system EE team and TPM team. You will also partner with external manufacturing partners to develop and document design rules and capabilities. **What Makes This Role Appealing** This role offers cross-domain exposure spanning electrical, opto-mechanical, and optical disciplines while building evolving frameworks with visible impact. You will have the flexibility to work across multiple projects while focusing on module electrical engineering designs. The role allows you to apply your fundamental expertise-whether in analog, digital, chip design, system integration, or circuit design-to a variety of application levels. If you're excited by shaping how engineering knowledge scales, you'll thrive here.

Responsibilities

Responsible for the implementation and debugging of mixed-signal ASICs, board-level circuitry, high-speed signal integrity and systems used in our solutions
• Develop novel solutions to complex electronics problems for Mixed Reality (MR), Wearables, AI devices, and Robotics applications
• Deliver electrical designs from concept through prototyping, validation, and mass production
• Apply industry-standard design, simulation, and analysis tools (e.g., Cadence, Altium, SPICE, MATLAB) to develop and verify electrical solutions
• Collaborate with cross-functional partners-including electronics, image sensors, optics, mechanicals, firmware, and system electrical engineering teams-on seamless integration of camera and depth modules into Meta's Reality Labs' devices
• Provide technical leadership in ASIC chip customization, driving architecture decisions and design optimization for camera and depth sensor applications
• Assess vendors and manage outsourced development of PCBs
• Lead debugging and failure analysis activities

Minimum Qualifications
• Bachelor's degree in Electrical Engineering or equivalent experience in electronic hardware development
• 6+ years of consumer product life cycles experience
• Experience with low-power analog circuit design, DC/DC converters, power management methods, A/D and D/A conversion and image sensors
• Experience designing electrical subsystems including power regulators, high-speed digital signal integrity (MIPI CPHY and MIPI DPHY), SOC and micro-controllers, serial-communication protocols (I2C, I3C, SPI, and LVDS)
• Experience with schematic capture and PCB design using Cadence OrCAD/Allegro or equivalent
• Experience with developing detailed test plans and performing electrical hardware validation
• Experience with laboratory validation work including the ability to test/validate/debug completed reworks/assemblies/development platforms using oscilloscopes, frame grabber, optical sensor devices, logic analyzers, impedance analyzers, and similar
• Experience using scripting languages like Matlab/Python for data analysis
• Experience running firmware commands to drive prototype platforms
• Experience in cross-functional collaboration

Preferred Qualifications
• Experience adhering to and implementing responsible, ethical AI practices (e.g., risk assessment, bias mitigation, quality and accuracy reviews)
• MS in Electrical Engineering or related fields
• Experience working with PCB, FATP, Joint Development Manufacturer (JDM), Original Design Manufacturer (ODM), Contract Manufacturer (CM), Module Integrator (MI) partners
• Experience partnering with software or firmware teams to define and verify HW design maturity across test cases
• Experience with camera or depth sensor or auto-focus electrical design
• Demonstrated ability to integrate AI tools to optimize/redesign workflows and drive measurable impact (e.g., efficiency gains, quality improvements)
• Consumer electronics experience and/or working within a mass-production environment
• 8+ years of consumer product life cycles experience
• Experience with laser driver or Camera and Depth sensor chip architectures
• Experience validating/verifying EE function blocks including custom ASICs
• Experience with end-to-end development of camera module electrical subsystem, system integration, and validation from the concept phase to mass production
• Experience developing modules or systems in high-volume consumer electronic products