Job Area:Engineering Group, Engineering Group > Hardware Engineering
General Summary:Job TitleBoard Engineer, Sr Staff
LocationSan Diego - US
Role / Skills / Exp The successful candidate will operate as a member of the Central Hardware Systems Board design & layout team, and will be able to design and document printed circuit board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. You'll collaborate with Data Center PDM, PM & Engineering teams to help design and implement schematics and constraints into high-quality PCB layouts for advanced breakouts + layout designs across Data Center, Server & Compute reference design form factor accurate platforms.
Key Responsibilities include - Design & Layout PCBs for reference & test DC, IOT, Server, Compute & 6G R&D systems, including form factor accurate (FFA) reference platforms and high-volume circuit boards.
- Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks.
- Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules.
- Collaborate effectively with internal teams in the U.S. and design partners globally to deliver high-performance PWB solutions.
- Liaise with internal stakeholders and external vendors to support HW platform & PCB fabrication and assembly throughout the product lifecycle.
The candidate is expected to have proficiency on Siemens/Mentor Xpedition, Altium or Cadence Allegro PCB design software and is expected to have experience in developing PCB design solutions for a variety of design types and working with internal teams and external suppliers to support PCB fabrication and assembly.
Minimum Qualifications - Experience using Xpedition or Allegro PCB design tools
- Familiar with COTS IOT Interfaces.
- Proficient with all MS Office 365 Tools.
- Understanding of how to use AI to efficiently solve problems.
- 12+ years actively involved in PCB high speed design.
- 12+ years actively involved in PCB design for HDI & high-density electronics packaging.
- 10+ years experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs.
- Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Education Requirements - BS Electrical or Equivalent Engineering or equivalent work experience
Minimum Qualifications:• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Preferred Qualifications - Experience as a Board design Engineer across HS layouts.
- Knowledge base of key component suppliers.
- Experience in Agile or similar PLM software.
- Proficient with all MS Office 365 Tools
- Understanding of how to use AI to efficiently solve problems.
- Design experience across RF, Analog, High-speed digital circuits - DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, LPDDR board designs & stackups.
- Expected to possess expert understanding and demonstrated application of PCB design principles, practices, and standards.
- Develops solutions to a variety of complex problems and proposes PCB design trade-offs to the PE team for resolution and implementation.
- Determine PCB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB's that meet schedule objectives.
- Understands the requirements driving PCB technology and process trends and their application to Qualcomm designs
- Maintain technical coordination with Engineering and Manufacturing. Resolve PCB design issues with fabrication and assembly vendors.
- Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
- Experience working with various EMI mitigation techniques and practices.
- Understands project goals and individual contribution toward those goals.
- Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
- Interact and collaborate with HW leads, Engineering team & other internal PCB designers for optimal product development processes and schedule execution.
- Effectively multitasks and meets aggressive schedules in a dynamic environment.
- Prepare and deliver design reviews to project team.
- Possess excellent verbal and written communication skills
- Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members
Pay range and Other Compensation & Benefits: $162,600.00 - $244,000.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.
