Job Summary:We are seeking a highly motivated Optical Packaging Associate Engineer help drive our hands-on engineering validations build & process development. The Associate Engineer will build fiber-coupled optical packages with photonic chips and work closely with the optical packaging and operations teams.
Responsibilities:- Support hand-on manufacturing of of fiber-to-chip packaged chip assemblies.
- Support the development, optimization, and validation of optical packaging and active alignment processes for photonic components and fiber attach assemblies.
- Assist in process characterization activities for optical module packaging, including alignment, adhesive curing, and optical performance evaluation.
- Execute experiments and collect data to improve optical coupling efficiency, process stability, and assembly yield.
- Support NPI (New Product Introduction) activities by contributing to process development, documentation, and production readiness.
- Participate in troubleshooting manufacturing and reliability issues using structured problem-solving methodologies.
- Help develop and maintain process documentation including work instructions, process flows, and control plans.
- Collaborate with cross-functional teams including design, manufacturing, test, and reliability engineering.
- Support equipment setup, calibration, qualification, and maintenance activities for optical assembly processes.
- Work with vendors and internal teams to evaluate materials, tooling, and process improvements.
- Analyze process and metrology data to identify trends and opportunities for yield and quality improvement.
Experience/Qualifications:- Bachelor's or Master's Degree in Engineering, Physics, Materials Science, or related technical field.
- 1-3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing environments (internships and research experience may be considered).
- Basic understanding of optical alignment, fiber optics, and optical measurement techniques.
- Exposure to semiconductor assembly, precision alignment systems, or automated manufacturing equipment.
- Hands-on laboratory or manufacturing experience with precision assemblies and metrology tools.
- Good communication and collaboration skills with cross-functional engineering teams.
- Strong problem-solving skills with the ability to work in a fast-paced development environment.
- Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly is a plus.
- Experience with data analysis tools such as Excel, JMP, MATLAB, or Python is beneficial.
- Understanding of statistical process control (SPC), DOE, or basic yield analysis concepts is a plus.
The ranges below reflect the target ranges for a new hire base salary. One is for the Bay Area (within 50 miles of HQ, Palo Alto), the second one (if applicable) is for elsewhere in the US (beyond 50 miles of HQ, Palo Alto). If there is only one range, it is for the specific location of where the position will be located. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.
U.S. Base Pay Range
$85,000-$120,000 USD
Bay Area Pay Range
$115,000-$130,000 USD
